Power board surface mounting places extremely stringent requirements on the thermal stability, wettability, and residue control of Solder Paste. Especially for bottom-pad components such as QFN and DFN packages, ordinary surface-mount solder paste is prone to issues such as insufficient solder climb, excessive voiding, or difficult cleaning. In contrast, the Domestic Solder Paste 8MQP/5RQ series uses T4-grade 0307 alloy powder, achieving nearly 100% solder climb coverage within the 240–260°C reflow range. Its total halogen content is controlled to the dual-item <1500ppm ROL1 grade, which not only meets the rosin-based activity requirements of IPC-J-STD-004B but also avoids the risk of electrical leakage caused by ionic contamination.

For scenarios with high heat dissipation requirements such as automotive lighting, the 8M9P/5RR zero-halogen solder paste reduces the halogen content to 0ppm ROL0. Paired with 305 alloy powder, it maintains a <2% void rate at a peak temperature of 250°C. Actual testing of an LED driver board under a heat Flux density of 120W/m² for 1000 hours of continuous aging showed no solder joint cracking. This is attributed to the synergistic effect of the flux system's continuous penetration of the oxide film in the soaking zone (150–180°C) and its rapid volatilization in the high-temperature zone (235–255°C).

Communication and laptop motherboards commonly select the 8MNTTP/5RNTT series. This Domestic Solder paste not only has halogen controlled to 100–200ppm ROL0 but, more importantly, is added with 00507BN and 00507B2N dual-nickel micro-alloyed powder. It still maintains clear solder ball contours and a <0.03% bridging rate in 0.3mm pitch BGA solder joints. Its residues appear transparent under optical inspection, allowing it to pass ICT probe testing without additional cleaning. After an ODM factory switched to this Power Board Solder paste, the AOI false positive rate dropped from 1.2% to 0.17%.

The water-washable domestic solder paste 8MW1P/5RW1 is suitable for low-cost production lines. The mixed powder of SC07 and 0307 ensures a viscosity decay rate of <8%/h during jet valve dispensing, and the surface ionic residue after washing is <0.7μg/cm² NaCl equivalent. However, it should be noted that its ROL1-grade halogen content (800–900ppm) is not applicable to medical or aerospace power boards. The aluminum-soldering dedicated solder paste 8MW5/5RW5, on the other hand, uses a compound of Sn42Bi58 and 0307 to achieve a shear strength of >28MPa on nickel-plated aluminum fins, with no white residue after washing. After a heat dissipation module factory used it to replace imported paste, the per-board solder paste cost decreased by 39%.

In laser welding scenarios, the 5RLJ series domestic solder paste is compatible with pneumatic valves and jet valves. The T6-grade 00507B2N powder has a particle size distribution of D50=5.2μm and D90<12.5μm. Paired with <500ppm ROL0 halogen control, it only takes 0.8s to complete 0.15mm pad lap welding under a 15W/cm² laser power, with no solder balls and an IMC layer thickness stably maintained at 1.8–2.3μm. In batch verification of a fingerprint lock main control board, the first-pass yield was stably maintained at 99.91%.