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Manual SMT rework soldering must precisely match solder wire diameter, soldering iron power, and actual soldering temperature; otherwise, cold solder joints, pad peeling, or thermal damage to components are highly likely to occur. Based on high-frequency production line fault cases, this paper compares the differences in temperature response curves, wetting speed, and solder joint morphology between 0.3mm and 0.5mm solder wires in typical scenarios such as QFN16, 0402 resistors, and shield can three-point grounding. It clearly points out that 0.3mm solder wire paired with a 35W soldering iron at 280℃ is more suitable for precision component rework soldering, while 0.5mm solder wire requires a soldering iron of 50W or above set at 320℃ to ensure the heat conduction efficiency of large pads.
Published: 2026-08-27
From June 17 to 20, 2026, NEPCON Thailand 2026, the most influential annual electronics manufacturing industry event in Southeast Asia, grandly opened at Hall 100 of BITEC International Trade & Exhibition Centre in Bangkok. The exhibition is hosted by Reed Exhibitions UK, and has been deeply cultivated through nineteen editions
Published: 2026-08-24
The explosive growth of the new energy vehicle market has driven increased demand for power device solders, with IGBT and SiC module soldering emerging as a new growth driver.
Published: 2026-08-24Welding thick copper boards directly determines the high-current carrying capacity and long-term operational stability of solder joints in new energy power boards. By optimizing the synergy among pad design, solder paste selection, and reflow profile, JJY ensures that solder joints on 2mm thick copper layers maintain a temperature rise within 35°C under a continuous current of 150A, avoiding common production line failures such as cold solder joints, excessive void rates, and thermal stress cracking.
Published: 2021-04-21Cold solder joints are almost impossible to identify visually with the naked eye or via conventional AOI, and must be exposed through power-on testing and thermal stress excitation. Their essence is the absence of continuous metallurgical bonding between the solder joint metals, leading to signal transmission interruption, abnormal temperature rise, and intermittent failures. Statistics from the JJY production line show that 73% of customer returns caused by cold solder joints occur after 48 hours of complete machine aging.
Published: 2017-01-15The solder used in energy storage modules directly determines the welding reliability of energy storage power supply protection boards and inverters. Jiajinyuan solder exhibits no cracks, low void rate, and an interface IMC thickness controlled at 3.2±0.4μm in 125℃ high-temperature cycle tests, and its wetting and spreading consistency on copper substrates and nickel-plated terminals is superior to that of common industry-standard tin-silver-copper systems.
Published: 2014-10-21To address the issues of solder paste collapse and excessive reflow void rate easily caused by the large copper foil and large pad structures of energy storage power boards, this paper is based on 20 years of measured experience on the Jiajinyuan production line, focuses on the matching of key parameters for solder paste selection, emphasizes that solder paste for large pads requires coordinated control of high thixotropic index and medium viscosity, and low-void solder paste must meet the synchronization between the flux volatilization curve and the thermal response of high heat capacity substrates, with the core focus on the wetting and spreading stability of solder paste under thick copper design.
Published: 2010-08-03The selection of solder paste for power boards must balance solder climbing capability, void rate, and halogen residue. Domestic solder pastes such as the 8MQP/5RQ series achieve nearly 100% solder climbing on QFN/DFN devices, while the 8M9P/5RR series is halogen-free with an extremely low void rate. The T4-grade 0307 alloy powder used in SMT solder paste forms stably within the 240–260°C reflow window. Domestic solder pastes now cover application scenarios ranging from communication motherboards to automotive lighting.
Published: 2009-05-15Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.