New energy Circuit Board Soldering places extremely stringent requirements on Solder Paste's wetting ability, void control, and halogen residue, especially for QFN/DFN packaged devices widely used in battery management system BMS and electric drive control boards. If solder paste with insufficient activity or mismatched alloy melting point is selected, problems such as incomplete solder climb and cracking after thermal cycling are highly likely to occur. The 8MQP/5RQ series, with its ROL1 rating of single halogen <900ppm, dual halogens <1500ppm, and fine particle size distribution of 0307/T4 alloy powder, achieves nearly 100% solder climb coverage in actual tests, making it particularly suitable for New Energy Solder Paste application scenarios with extremely high wettability requirements.

Automotive-grade LED headlight modules are highly sensitive to void rate. After reflow of conventional high-temperature solder paste, solder joint voids often exceed 15%, leading to increased thermal resistance and shortened lifespan. The 8M9P/5RR series achieves extremely low void rate with 0ppm halogen and ROL0 rating, and cooperates with 305/T4 alloy powder to complete reliable melting within the 235–255℃ window. It has been batch-verified on headlight PCBs of multiple new energy vehicle manufacturers, with solder joint X-ray inspection showing void rate stably controlled within 3.2%, fully meeting AEC-Q200's reliability requirements for power device solder joints.

Communication base station power boards and automotive T-BOX motherboards generally use 0.4mm pitch BGA and 01005 passive components, and ionic contamination from residues can easily cause CAF failure. The 8MNTTP/5RNTT series compresses halogen to 100–200ppm and adopts 00507BN/T5 ultra-fine powder, maintaining good release performance even when stencil opening is ≤0.12mm. After reflow, residues are minimal and transparent, with measured surface insulation resistance >1.2×1011Ω, greatly reducing post-soldering cleaning costs and ion migration risks for PCB solder paste.

Dissimilar metal soldering between aluminum-based heat sinks and nickel-plated copper bars has long plagued new energy production lines. Ordinary solder paste has poor wettability and is prone to cold soldering. The 8MW5/5RW5 series achieves effective metallurgical bonding at the aluminum/nickel interface through the synergy of SC07+0307 composite alloy powder and water-washable rosin system under 180℃ preheating + 245℃ peak temperature. Residues can be completely removed by rinsing with DI water after soldering, avoiding the gray-white corrosion film formed by traditional no-clean solder paste on aluminum surfaces, truly balancing Solder Joint Strength and environmental compliance of Domestic Solder Paste.

Laser jet soldering is increasingly applied in battery sampling FPC reinforcement areas, but most solder pastes are prone to splattering or forming solder beads under millisecond-level heating. The 5RLJ series is optimized for pneumatic valves and jet valves with rheological properties, paired with 00507B2N/T6 alloy powder to make the viscosity gradient gentler. It completes solder-bead-free soldering under 12W laser power and 0.8s exposure time, with measured solder joint thrust reaching 8.3N, a 37% improvement over general high-temperature solder paste. It has been used in the module-level PCB solder paste laser micro-soldering process of a leading power battery manufacturer.