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Here you can find knowledge about New Energy Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
New energy circuit boards have extremely high requirements for soldering reliability; even a slight deviation in the selection of solder paste and solder wire can cause batch defects such as cold solder joints, bridging, and excessive voiding rates. Combined with real production line failure cases, this article directly addresses core pain points such as insufficient solder paste activity matching, mismatched silver content in solder wire, and lack of coordination between reflow profile and solder paste melting point, and provides immediately executable material verification processes and parameter locking methods.
Published: 2026-08-27
The SMT solder industry is accelerating its intelligent transformation, with Industry 4.0 technologies improving solder production consistency and quality control levels.
Published: 2026-08-24
New energy vehicle electronics include ADAS, millimeter-wave radar, BMS, domain controllers and other full-vehicle components, which are subject to long-term vehicle vibration and wide-range temperature cycles. High-frequency signal and high-voltage high-current scenarios impose stringent requirements on welding reliability.
Published: 2026-08-24
The LFP-5RLJ series laser lead-free high-temperature solder paste and LFP-5RLJB laser medium-low temperature solder paste have achieved new breakthroughs in precision laser welding processes.
Published: 2026-08-24
The explosive growth of the new energy vehicle market has driven increased demand for power device solders, with IGBT and SiC module soldering emerging as a new growth driver.
Published: 2026-08-24
Solder technology iteration in SMT has accelerated significantly. Starting from January 2026, Senju Metal Industry, Shengmao Technology, Indium Corporation, and Loctite China have successively launched new SMT solder products featuring low void rate, high wettability, and halogen-free enhancement, covering packaging scenarios from 01005 to fine-pitch BGA. Some products have passed production line verification by leading EMS manufacturers and entered the small-batch introduction stage.
Published: 2026-06-22
Industry observations indicate that in the fourth quarter of 2025, EMS capacity expansion in Southeast Asia accelerated, with over 140 new SMT placement lines added in Vietnam and Malaysia, of which 67% of production lines explicitly require solder suppliers to hold IATF 16949 automotive electronics compatibility certification and possess localized rapid response capabilities.
Published: 2026-04-19
SMT solder technology iteration has accelerated significantly. Starting from January 2026, enterprises including Senju, Shengmao, VTTI, and Yunchuang Precision have collectively released new SMT solder solutions such as low-void-rate lead-free solder paste, high-temperature reflow compatible solder paste, and low-spatter formulations for nitrogen environments. The products focus on three major directions: high reliability, fine-pitch compatibility, and green process compatibility, responding to the stringent requirements for soldering consistency in 5G communication modules, automotive-grade MCUs, and AI server PCBs.
Published: 2026-04-11
SMT solder applications are rapidly expanding from traditional consumer electronics to high-reliability scenarios such as photovoltaic inverters, energy storage BMS, and new energy vehicle electronic control systems. Since January 2026, multiple leading solder manufacturers have reported that orders from new energy customers have exceeded 35%. The combined application of lead-free high-temperature alloy solder and low-temperature sintered silver paste has become a key support for production line upgrades.
Published: 2026-04-09
The electronics manufacturing exhibition held at the Shanghai New International Expo Centre from January 15 to 17, 2026, showcased substantial progress in SMT solders in areas such as high reliability, low-temperature lead-free technology, and fine-pitch compatibility. Multiple leading material manufacturers released new SMT solders tailored for Chiplet packaging and automotive PCBs. The industry consensus is shifting from purely compositional optimization toward the coordinated verification of process compatibility and long-term thermomechanical stability.
Published: 2026-02-21Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.