New Energy Solder Paste

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New Energy Solder Paste
Home New Energy Solder Paste New Energy Solder Paste for Energy Storage PCBs, SMT Solder Paste for New Energy Modules

New Energy Solder Paste for Energy Storage PCBs, SMT Solder Paste for New Energy Modules

New Energy Solder Paste Knowledge

Here you can find knowledge about New Energy Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.

Selection of Thermal Fatigue Resistant Solder Paste for New Energy Energy Storage Electronic Control Boards

To address the issue of solder joint cracking caused by concentrated thermal stress in energy storage new energy electronic control boards during frequent charge-discharge cycles, solder paste with high ductility, low elastic modulus, and excellent thermal cycle life must be selected. New energy solder paste must pass thermal shock verification at -40℃ to 125℃ for more than 1000 cycles, while reliability solder paste emphasizes the uniformity of the IMC layer and the stability of the Cu6Sn5 phase. The metal content, particle size distribution, and flux residue ion concentration of the solder paste jointly determine its long-term thermal fatigue resistance.

Published: 2016-07-02

Domestic Solder Supports Sample Proofing, Applicable to New Energy, Medical and Electronics Industries

Domestic solder has achieved full-process controllability from material formulation to batch stability, supports customers in small-batch sample trial and prototyping, and is widely adapted to scenarios such as new energy vehicle BMS modules, high-reliability PCBA for medical monitors, and consumer fast-charging boards. It can maintain 4-hour printing stability under workshop temperature control of 25℃~30℃. The thixotropic index of Jia Jinyuan solder paste reaches 0.72, with a viscosity recovery rate ≤15%, fully meeting the fine printing requirements of 0201 components and 0.3mm pitch QFN.

Published: 2015-10-22

Solder ODM R&D: Solder Development for High-Reliability Products in Medical, New Energy and Other Fields

Leveraging its solder ODM R&D capabilities, JJY has developed solder pastes and preformed solder sheets with low voiding rate, zero halogen, and high-temperature reflow resistance for scenarios such as medical equipment, new energy vehicle electronic control, and high-reliability industrial modules. Their solder joint thrust reaches over 85MPa, and the IMC layer thickness is controlled within the range of 1.2~1.8μm, meeting the dual certification requirements of ISO 13485 and AEC-Q200.

Published: 2014-09-13

Welding of New Energy Circuit Boards: Recommendations for Domestic Solder Paste Brands

To address production-line pain points in new energy circuit board soldering, such as poor solder climbing, high voiding rate, and excessive halogen residue, this paper draws on 20 years of frontline SMT experience to recommend multiple domestic solder pastes suitable for QFN/DFN packages, automotive lighting, and high-precision communication modules, covering niche scenarios including zero-halogen, water-washable, laser-specific, and ultra-low-temperature formulations. It focuses on analyzing the real process performance of the 8MQP/5RQ, 8M9P/5RR, and 8MW5/5RW5 series in meeting the three core demands for new energy solder paste, PCB solder paste, and domestic solder paste.

Published: 2009-04-05

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