SMT Solder Paste Manufacturers.
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In 2026, innovation in solder paste materials is accelerating, with new nano-additive technologies being gradually applied in high-end soldering scenarios to improve solder joint reliability. As the electronics manufacturing industry continues to raise its requirements for precision processes, solder paste, as a key material, is undergoing technological innovation, driving the industry toward higher standards.
Published: 2026-01-08
Addressing the industry pain point that solder joints on new energy electronic control boards are prone to cracking and have insufficient reliability under high-low temperature cycling conditions, Jiajinyuan has launched a variety of halogen-free and lead-free high-temperature solder pastes, covering segmented scenarios such as high solder climb for QFN/DFN, low void rate, zero halogen, and laser welding. Its 0307, 305 and other alloy systems at 240
Published: 2026-01-04Relying on its solder ODM R&D capabilities, JJY has developed customized new solder formulations with low residue, high wettability and narrow melting range for special soldering processes such as laser solder paste jetting, vacuum reflow and low-temperature thermocompression bonding. These formulations have been successfully adapted to scenarios including 01005 component micro-pads, Cu/Ni/Au plating and dissimilar metal bonding, significantly reducing void rate and the risk of excessive IMC growth.
Published: 2024-05-11
In 2023, the solder paste market showed a diversified development trend, with traditional industrial applications continuing to integrate with emerging fields such as new energy and semiconductors. The driving factors include technological progress, industrial transformation, and policy support. Industry practitioners need to pay attention to changes in market demand and optimize product structure.
Published: 2024-02-08Circuit board soldering faces multiple challenges of high reliability, fine pitch, and heat-sensitive components in the medical, communication, and new energy sectors. Based on practical production line experience, this paper focuses on key processes such as solder paste selection, stencil aperture design, reflow profile optimization, and BGA rework, emphasizing solder joint wettability, void rate control, and cold solder joint identification methods. All parameters are derived from measured data from Jia Jinyuan production lines, without theoretical deduction.
Published: 2023-01-22QFN soldering on new energy electronic control boards faces dual challenges of high-frequency vibration and thermal cycling. By optimizing stencil aperture design, reflow profile, and pad design, Jiajinyuan has increased the thrust of QFN solder joints to over 28N, with the IMC layer thickness controlled at 3.2μm±0.4μm, effectively suppressing microcrack propagation and meeting the long-term reliability requirements of automotive-grade IPX7 protection and operating conditions ranging from -40℃ to 125℃.
Published: 2022-12-11Welding thick copper boards directly determines the high-current carrying capacity and long-term operational stability of solder joints in new energy power boards. By optimizing the synergy among pad design, solder paste selection, and reflow profile, JJY ensures that solder joints on 2mm thick copper layers maintain a temperature rise within 35°C under a continuous current of 150A, avoiding common production line failures such as cold solder joints, excessive void rates, and thermal stress cracking.
Published: 2021-04-21Voids can easily cause fatal defects such as cold solder joints, bridging, and BGA cracking in the SMT process of new energy, medical, and communication electronic products. Production line data from Jia Jinyuan shows that the failure rate of BGA devices with a void rate exceeding 8% increases by 3.2 times. Closed-loop control must be achieved through stencil aperture optimization, dynamic calibration of squeegee pressure, and real-time monitoring of nitrogen purity.
Published: 2020-10-04X-Ray inspection is an irreplaceable quality control method in the mass production of new energy battery management systems, medical imaging equipment motherboards, and 5G communication base station PCBs. It can penetrate multi-layer stacked structures to accurately identify defects invisible to the naked eye such as BGA cold solder joints, PTH via copper fractures, and embedded capacitance offset. Jiajinyuan X-Ray inspection equipment achieves a 99.2% defect capture rate at a 0.5μm detail resolution, and has become a mandatory verification step before batch shipment on high-end SMT production lines.
Published: 2019-01-21Jiajinyuan PCBA soldering materials are specifically designed for new energy battery management system BMS boards, photovoltaic inverter control boards, and industrial PLC main control boards. Its low-void-rate solder paste maintains a stable void area of less than 12% after reflow in 0.3mm fine-pitch QFN packages, which can be further reduced to 8.5% with a nitrogen atmosphere, meeting the stringent requirements of automotive-grade AEC-Q200 for solder joint reliability.
Published: 2016-12-27Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.