New energy vehicle BMS motherboards extensively use double-sided mounting + thick copper design, which causes traditional AOI to completely fail for bottom QFN solder joints. X-Ray inspection can penetrate 2.8mm thick aluminum substrates to clearly show the internal void distribution of Sn96.5 solder joints. Our on-site testing at a customer's production line found that when the void area ratio exceeds 23%, the high-temperature aging failure rate of modules increases sharply by 4.7 times. Therefore, X-Ray inspection must be embedded in the 100% full inspection station after Reflow Soldering; otherwise, the rework cost per board will exceed 1.8 times the price of new materials.

The FPGA package size of medical CT motherboards has shrunk to 12mm×12mm with a pin pitch of 0.4mm. After Manual Soldering, it is impossible to measure connectivity point by point with a multimeter. X-Ray inspection, combined with JiajinYuan's self-developed dynamic grayscale threshold algorithm, can complete the solder ball integrity analysis of a single chip within 3.2 seconds. Especially for micro solder balls with a diameter of 0.15mm, the recognition accuracy of cold solder joints reaches 98.6%. This reduces the missed judgment rate by 82 percentage points compared to relying on manual visual inspection, directly avoiding the passive situation of difficult traceability after the whole machine's EMC test fails.

5G AAU communication motherboards generally use HDI structures with more than 12 layers. If the offset of embedded capacitors in layers 5 to 8 exceeds ±15μm, it will cause high-frequency signal reflection. AOI and ICT have no response to such hidden defects. Only X-Ray inspection can locate deviations at the ±3μm level through dual-angle projection image reconstruction. When we verified at the production line of a base station supplier in Shenzhen, we found that batches without X-Ray screening had a reset abnormality rate as high as 17% in the -40℃ condensation test. After introducing X-Ray inspection, this indicator was suppressed to within 0.3%, indicating that this inspection is not an optional item but a hard threshold for mass production delivery.

The focal spot size of JiajinYuan's X-Ray equipment is stably controlled at 0.8μm. Combined with the ±0.02mm repeated positioning accuracy of the stage, it can continuously scan 300 boards without image distortion drift. Its automatic programming module supports directly extracting BGA coordinates from Gerber files and generating inspection paths, saving 3.5 hours per model of manual teaching debugging time. This is particularly critical for small-batch medical board production with frequent switching, as every 1 hour of delay in going online equals an additional backlog of 47 boards to be inspected.

All X-Ray images must be bound and archived with the MES system, with a retention period of no less than the product life cycle plus 2 years. Because a customer once complained about occasional crashes in a batch of electrocardiogram motherboards, it was by retrieving the original X-Ray images from 14 months ago that a 0.09mm microcrack was found in the 9th layer power plane. This traceability capability makes JiajinYuan's equipment the most unavoidable node in the production line quality closed loop.