Starting from January 2026, leading domestic SMT Solder Manufacturers such as Yunhai Metal, Keshengda, and Heraeus Electronic Materials Division have successively disclosed changes in their quarterly order structure. Year-on-year growth in shipments related to new energy equipment reached 42% to 48%. Among them, photovoltaic inverter main control boards, liquid-cooled energy storage system BMS modules, and 800V high-voltage platform vehicle OBC and DC-DC converters have become the three major categories of terminals with the most concentrated new SMT Solder consumption. This trend is highly consistent with the guidance in the Ministry of Industry and Information Technology's "Smart Photovoltaic Industry Innovation and Development Action Plan (2024, 2027)" regarding increasing the localization rate and process adaptability of power electronic equipment.

The technical director of a large EMS foundry in Shenzhen pointed out at the South China Electronic Manufacturing Summit held on January 15, 2026 that the BMS control board production line supporting CATL's energy storage PACK factory has fully switched to bismuth-containing lead-free high-temperature solder since the third quarter of 2025. The peak reflow temperature is stably maintained in the range of 260℃±3℃, and the thermal shock resistance of solder joints meets the requirements of -40℃ to +125℃ cycle conditions. At the same time, no significant fluctuation in Solder Paste printing yield has occurred, indicating that the current iteration of SMT solder formulations can already balance the dual constraints of high reliability and production line compatibility required by new energy equipment.

An ODM enterprise in Suzhou Industrial Park focusing on automotive-grade PCBA completed the renovation of its second SMT line in early January 2026, adding a nitrogen-protected reflow oven and an online X-ray inspection module. It also simultaneously introduced silver-doped low-temperature sintering solder paste for IGBT drive circuit mounting. This solution increased the solder joint shear strength to over 32MPa, approximately 27% higher than traditional SAC305 solder, but did not significantly increase the manufacturing cost per board. This reflects that the engineering adaptation of SMT solder on the material side has entered a mature implementation stage, rather than remaining only at the laboratory parameter level.

The "Quarterly Monitoring Briefing on Electronic Soldering Materials" released by the China Electronic Materials Industry Association in January 2026 shows that the total domestic SMT solder shipments in the fourth quarter of 2025 were 18,900 tons. Among them, the proportion clearly marked for new energy equipment applications rose to 36.2%, an increase of 11.7 percentage points from the same period in 2024. Meanwhile, the proportion of traditional mobile phone motherboard applications declined to 29.4%. This structural change has been cross-verified in the production scheduling plans of more than ten packaging substrate and PCB carrier board suppliers in East China and the Pearl River Delta. Some enterprises have begun adjusting Tin Ingot procurement cycles and alloy element pre-mixing ratios to match the longer delivery windows and stricter batch consistency requirements of new energy customers.

It is worth noting that the current expansion of SMT solder in the new energy field is not a simple substitution, but evolves synchronously with changes in packaging forms. For example, photovoltaic inverter manufacturers generally adopt a double-sided SMT + potting adhesive process, which puts forward new indicators for solder wettability and residual ion content. Automotive-grade domain controllers, due to the introduction of SiC MOSFET devices, are forcing solder manufacturers to jointly define new temperature profiles and atmosphere control protocols with reflow oven manufacturers. This cross-link collaboration is reshaping the technical service boundaries and value delivery methods of SMT solder.