The JJY LFP-5RLJ series laser Solder Paste includes two products: the LFP-5RLJ-305 high-temperature type and the LFP-5RLJB-4258 medium and low-temperature type. It is developed specifically for laser selective soldering processes, and demonstrates unique advantages in the soldering of precision devices and heat-sensitive components.

The core of laser solder paste lies in the response characteristics of the Flux system to laser energy. The LFP-5RLJ series adopts a specially formulated laser absorption-enhancing flux, which can rapidly form a local molten pool under laser irradiation at 1064nm and 980nm wavelengths, resulting in a small soldering heat-affected zone and avoiding thermal damage to surrounding components.

The melting point of the LFP-5RLJB-4258 medium and low-temperature type product falls within the low-temperature range of the 4258 series alloy. When paired with laser soldering, it enables a low-temperature soldering process ranging from 138℃ to 180℃, making it suitable for post-stage assembly soldering of temperature-sensitive devices already mounted on PCBs, such as buzzers and battery connectors.

Practical application tests show that this series of laser solder paste produces well-formed solder joints in scenarios such as connectors, FPC soldering, and CCD module assembly, with no solder ball spattering and excellent soldering consistency. It can significantly reduce the local soldering yield bottleneck that cannot be addressed by traditional Reflow Soldering.