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Berita Industri

Domestic SMT solder brands secure new orders in overseas markets

Industry observations show that in the fourth quarter of 2025, EMS capacity expansion in Southeast Asia accelerated, with more than 140 new SMT placement lines added in Vietnam and Malaysia. Among these, 67% of production lines explicitly require solder suppliers to hold IATF 16949 automotive electronics compatibility certification and provide localized rapid response capabilities. Domestically, third-party certification coverage and forward warehouse construction in the ASEAN region were completed within 2025, reflecting that the supporting capacity of the industrial chain is shifting from single product exports to the output of systematic process service capabilities.

It is worth noting that the order was not signed under the traditional FOB trade term, but in the form of CIF plus local technical support package. The contract explicitly stipulates that the melting point deviation between solder batches shall be ≤±1.2℃, the ionic contamination value of active residues shall be <0.8μg/cm2, and the viscosity attenuation rate within 48 hours after opening shall be <5%. These quantitative indicators are close to the commercial delivery standards of Senju of Japan and KEP of South Korea, while the price level remains at 82%–86% of the quotation of similar Japanese products, reflecting the phased breakthrough of domestic SMT Solder in cost structure optimization and process control accuracy.

According to the *SMT Solder Import and Export Monitoring Briefing* released by the China Electronic Materials Industry Association in January 2026, China's total SMT solder exports reached 970 million yuan in 2025, a year-on-year increase of 13.4%. Among them, the proportion of exports to RCEP member countries rose to 58.6%, an increase of 7.2 percentage points compared with 2024. However, the export share of high-reliability fields such as automotive-grade and industrial-grade solder is still less than 11%. Its technical verification path and service model may provide a replicable implementation paradigm for more domestic SMT solder enterprises to enter the mid-to-high-end overseas markets in the future.

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