From January 15 to 17, 2026, the 28th China International Electronic Production Equipment and Microelectronics Industry Exhibition was held at the Shanghai New International Expo Centre. This exhibition took SMT Solder application upgrading as the main line of technical observation. More than 40 suppliers of solder materials and auxiliary materials on site collectively displayed a new generation of SMT solder solutions for segmented scenarios such as automotive electronics, AI server motherboards, and wearable devices. Among them, tin-silver-copper series low-temperature Eutectic Solder, nickel-containing micro-alloyed Solder Paste, and low-collapse high-wettability solder paste adapted to 0.3 mm pitch CSP devices became high-frequency technical keywords.

The SN100CL-Plus solder exhibited by Sumitomo Metal Mining starts melting at 138 degrees Celsius, with the peak reflow temperature controlled within 225 degrees Celsius. It has passed 2000 cycles of AEC-Q200 automotive-grade thermal cycling test without solder joint cracking. Since the third quarter of 2025, this material has been included in the certification lists of secondary PCB module suppliers for BYD and CATL, and is currently in the small-batch introduction stage. Its mass production yield fluctuation range is stable between 99.82% and 99.87%, an increase of about 0.15 percentage points compared with the previous generation product.

The M705X series solder paste released by Senju Metal adopts a non-spherical silver-coated copper powder composite system, achieving a solder joint bridging rate lower than 0.018% in the mounting of 0.25 mm pitch QFN devices. Combined with its matching no-clean rosin-based Flux, the residual ion contamination level under nitrogen-protected reflow environment is controlled below 0.21 micrograms NaCl per square centimeter. This combined solution has completed a three-month production line test at Luxshare Precision's Kunshan factory, reducing average line changeover time by 11% and solder bead occurrence rate by 37%.

The SMT process seminar held concurrently with the exhibition disclosed that the overall domestic production rate of SMT solder in China has increased from 34% in 2021 to 58.6% by the end of 2025. However, the high-end automotive and medical electronics fields still rely on supplies from Japanese and German manufacturers. Especially in key indicators such as the consistency of oxide layer thickness between solder batches and the controllability of intermetallic compound growth rate, the CPK values of the top three local enterprises are concentrated in the range of 1.32 to 1.45, which has not yet fully reached the level of above 1.67 generally maintained by leading international enterprises.

Some participating manufacturers reported that since the fourth quarter of 2025, downstream customers have increased the frequency of TS16949 system audits for SMT solder by 40%, and simultaneously required the provision of DSC thermal analysis original curves and IMC growth acceleration test reports for each batch of solder paste. This quality control pressure transmitted by terminal brand owners is forcing material enterprises to compress the R&D verification cycle from an average of 14 months to within 9 months, and simultaneously strengthen collaborative work with PCB manufacturers and SMT placement factories on joint process window definition.