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The control of the dwell time of the OSP board welding production line is directly related to the chemical stability and solderability of the OSP film layer. If the exposure time of the PCB from the spray OSP treatment to before reflow soldering exceeds 48 hours, or if it stays in a high-temperature and high-humidity environment (such as RH > 60%, T > 25°C) for more than 24 hours, the film layer is prone to hydrolysis and oxidation, which will cause the solder joint void rate to increase by more than 12% and the wetting angle to increase to more than 45°. Actual measurements on the Jiajinyuan production line show that this problem accounts for 67% of the solder bridging defects in OSP board welding.
Published: 2021-07-09Welding thick copper boards directly determines the high-current carrying capacity and long-term operational stability of solder joints in new energy power boards. By optimizing the synergy among pad design, solder paste selection, and reflow profile, JJY ensures that solder joints on 2mm thick copper layers maintain a temperature rise within 35°C under a continuous current of 150A, avoiding common production line failures such as cold solder joints, excessive void rates, and thermal stress cracking.
Published: 2021-04-21PCBA soldering materials cover a full range of auxiliary materials including solder paste, solder wire, flux, cleaning agent and nitrogen. Their selection and control directly determine the SMT placement first-pass yield and long-term reliability. The Jiajinyuan series performs stably under stringent parameters such as reflow soldering peak temperature of 235℃±5℃, solder paste viscosity of 700±100Pa·s, and flux solid content of 18.5%.
Published: 2021-04-07When soldering 5G devices on high-frequency PCBs, solder faces the practical issue of increased void rate that exacerbates signal attenuation. By optimizing metal content, rheological properties, and flux volatilization pathways, low-void solder paste has been verified on actual production lines of the Jiajinyuan JH-5G series, stably controlling the void rate of BGA solder joints within 8%, significantly improving the impedance continuity and return loss performance of RF modules in the millimeter-wave frequency band.
Published: 2021-01-19When soldering BGA devices on thick copper boards, due to the large heat capacity and slow heating rate, the flux in the solder paste does not volatilize sufficiently and gas escape is hindered, making it extremely easy to form void defects inside solder joints. It is necessary to select a special solder paste with low residue, high activity, and a wide reflow window; otherwise, the void rate generally exceeds 25%, far exceeding the requirement of ≤15% for IPC-A-610 Class G.
Published: 2020-12-08BGA soldering in 5G communication and energy storage motherboards faces challenges of high thermal stress, long-term aging, and high-frequency signal integrity. By optimizing stencil aperture design, segmented temperature control of reflow profile, and post-soldering full X-ray inspection process, JJY ensures that BGA solder joints have no void expansion and no abnormal IMC thickening after 1000 hours of accelerated aging at 85℃/85%RH, achieving true long-term reliability.
Published: 2020-08-15The solder for industrial control motherboards must maintain zero solder joint cracking under wide temperature range, high vibration and long-cycle operating conditions. Jiayuan's high-reliability halogen-free formula, by optimizing the SnAgCu alloy ratio and active flux system, keeps the IMC layer thickness stably at 3.2±0.4μm after 500 cycles of thermal shock from -40℃ to 85℃, completely avoids electromigration failure caused by halogen corrosion, and significantly improves the service life of industrial control motherboard solder in harsh scenarios such as rail transit and power monitoring.
Published: 2020-07-01The reflow oven's temperature zone configuration must match the PCB thickness and component heat capacity. Thin boards require shortened preheating time to prevent warpage, while thick boards need extended soaking zones to ensure uniform heating of inner layers. Large heat capacity BGA or metal-cased components require stable peak temperature and sufficient reflow time. The Jiajinyuan reflow oven achieves precise adaptation through adjustable conveyor speed and independent temperature control for each zone.
Published: 2020-05-25To address common issues such as cold soldering, poor wetting, and solder beads that frequently occur in the high-volume production of consumer electronics motherboards with OSP boards, this solution is based on measured production line data from Jia Jinyuan, focusing on four key measures: stencil aperture optimization, dynamic nitrogen concentration control, reflow oven temperature zone gradient matching, and AOI false alarm rate reduction. It stably improves the first-pass yield of OSP board soldering to 99.23%, with a single-line daily output exceeding 8500 units.
Published: 2020-02-17Through on-site testing of Jiajinyuan domestic solder on the SMT production line under combinations of different temperature zone profiles, stencil apertures, and squeegee pressure settings, the soldering performance on circuit boards was evaluated. It was found that the difference in wettability and void rate between this domestic solder and imported materials is less than 8%. After optimizing solder paste storage temperature control and fine-tuning the nitrogen purity of the reflow oven, the first-pass yield of PCBA increased from 92.3% to 96.7%, significantly reducing circuit board soldering defects such as cold solder joints, tombstoning, and bridging.
Published: 2019-08-26Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.