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Here you can find knowledge about QFN Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Excessive voiding in the bottom thermal pad during QFN soldering is a high-frequency failure point in production lines, rooted in improper solder paste volume control. Jia Jinyuan SG-880 series solder paste, used with a 0.15mm stencil aperture and 25℃ environmental temperature control, can reduce the void rate to below 8%. This solution has been continuously verified on the mass production line of automotive MCU modules for 6 months.
Published: 2013-07-18When soldering BGA/QFN chips via SMT, an excessive void rate can lead to cold solder joints, increased thermal resistance, and early failure, and low-void solder paste is the core solution to this problem. The void rate of Jiajinyuan JL-808 series solder paste is stably controlled below 8% in mass production. Combined with optimized stencil aperture design and nitrogen-protected reflow, it can reduce the void rate at the bottom of QFN packages from 25% to 6.3%, while the void rate of individual BGA balls is simultaneously reduced to 4.1%.
Published: 2013-03-25The QFN soldering process requires precise control of solder paste volume, stencil aperture, and reflow profile. Actual measurements on Jia Jinyuan's production line show that a 0.12mm-thick stencil with 30μm trapezoidal apertures can effectively inhibit cold solder joints and bridging. Combined with reflow parameters of a peak temperature of 235℃±2℃ under nitrogen protection and a time above liquidus of 65 seconds, the first-pass yield of QFN soldering is stably maintained above 99.2%.
Published: 2010-06-17SMT stencils directly affect solder paste release rate and void rate in optimizing the aperture ratio of pads under BGA/QFN. Actual measurements by JJY show that an aperture ratio of 0.72～0.85 can balance the filling performance of QFN thermal pads and the risk of bridging for BGA fine-pitch solder balls. Too low a ratio easily leads to cold solder joints, while too high a ratio causes tombstoning or solder balls.
Published: 2010-05-11QFN package soldering places extremely high requirements on the solder paste's wetting ability, void rate, and residue. The zero-halogen solder paste of the 8M9P/5RR series launched by domestic solder paste brand Jiajinyuan achieves an extremely low void rate. When paired with 0307T4 alloy powder, it forms stably within the 240–255℃ reflow window. Meanwhile, the 8MQP/5RQ series achieves nearly 100% wetting for QFN solder paste thanks to its high activity, making it a key practical option for low-void solder paste and for domestic solder paste to replace imported alternatives.
Published: 2009-02-22Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.