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Here you can find knowledge about Printing Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Solder paste stencil printing defects are a high-frequency failure in SMT production lines. Essentially, they occur when solder paste fails to transfer completely onto PCB pads. The root causes are often intertwined with stencil aperture accuracy, tension degradation, and the rheological properties of the solder paste. It is necessary to simultaneously inspect stencil wear status, squeegee pressure parameters, and changes in solder paste viscosity. Neglecting any of these aspects will lead to false yield fluctuations.
Published: 2010-05-16The wiping frequency of solder paste stencils directly affects the uniformity and profile clarity of printed solder paste. Excessive wiping accelerates stencil tension decay and causes insufficient solder paste deposition, while insufficient wiping easily leads to solder paste drying, aperture clogging, and induces typical defects such as solder bridging and insufficient solder. Therefore, to scientifically formulate solder paste control strategies, wiping frequency must be included as a key process parameter for dynamic calibration.
Published: 2010-03-19To address pain points such as prolonged printing without drying, solder paste slump, and poor solder wetting on SMT production lines, this domestically produced solder paste uses a rosin-based formula combined with 0307/T4 alloy powder. Within a reflow window of 240–255℃, it achieves nearly 100% solder wetting rate for QFN/DFN packages, with a halogen content below 900ppm and transparent residue. It balances printing stability and soldering reliability, making it a cost-effective choice as an alternative to imported printing solder paste, SMT solder paste, and domestic solder paste.
Published: 2009-05-23Continuous printing solder paste directly affects yield and line changeover efficiency in SMT production lines. Based on measured data from 12 domestic solder paste series of JJY, this paper compares halogen-free grades, alloy powder types, solder climbing capability and residue characteristics, focusing on analyzing the performance differences between the 8MQP/5RQ high-activity models and the 8M9P/5RR zero-halogen low-void models in QFN continuous printing, to provide reusable process window judgment criteria for SMT solder paste selection.
Published: 2009-05-05Addressing the printing challenges of 0201 small components, domestic solder pastes need to balance the high-resolution transfer rate and low voiding rate of fine-powder solder pastes. Two 0201 solder pastes, Jiajinyuan LFP-JJY5RNTT-0307 and LFP-JJY5RR-0307, are recommended. The former contains 00507BN/T5 fine powder with 100~200ppm halogen, suitable for high-precision consumer electronics. The latter is halogen-free ROL0 grade with T4 powder, featuring outstanding thermal cycling reliability, and has achieved 98.7% solder joint coverage on mobile phone motherboard production lines.
Published: 2009-04-23To address the mounting challenges of 01005 micro components, domestic solder paste brands have achieved stable printing and solder wetting of high-density solder pastes in openings below 0.3mm through the synergistic optimization of T4/T5 grade ultra-fine alloy powder, ROL0 grade ultra-low halogen control, and rosin-based active systems. Among them, the 8MNTTP/5RNTT series achieved over 92% solder joint coverage in actual tests on mobile phone motherboards, significantly outperforming conventional T3 powder solutions.
Published: 2009-04-21The spherical solder paste made from spherical tin powder of domestic solder paste brand Jiajinyuan performs outstandingly in practical test scenarios such as nearly 100% solder climbing rate in QFN/DFN, extremely low void rate, transparent residue and water washability. Its series including 8MQP/5RQ, 8M9P/5RR, 8MW1P/5RW1 all adopt T3/T4 grade high-sphericity 0307/305 alloy powder, which meets the process requirements of high-speed printing solder paste, and satisfies the stringent requirements of automotive electronics, communication terminals and precision consumer electronics for forming effect and reliability.
Published: 2009-02-24Frequent solder paste clogging in stencils directly affects the efficiency and yield of SMT production lines. By optimizing the particle size distribution of alloy powder, the rheological properties of the rosin carrier, and the control of halogen residues, domestic anti-clogging solder paste achieves stable release and high solder wetting rates in fine-pitch printing applications such as QFN/DFN. A typical example is the 8MQP/5RQ series T4 powder paired with 0307 alloy, which balances printability and reflow performance, making it a cost-effective alternative to imported printing solder paste.
Published: 2009-01-23Domestic solder paste with clear printing and forming profiles must balance thixotropy, powder distribution, and reflow wettability. The Jiajinyuan 8MQP/5RQ series achieves high-resolution printing while delivering near-100% solder fillet climb rate on QFN packages. The 8MNTTP/5RNTT variant, with its ultra-low halogen content of 100~200ppm and T5-grade fine powder, is tailored for high-precision consumer electronics. These solder pastes with excellent forming performance have been batch-validated on SMT production lines, making them a reliable domestic alternative to imported SMT solder paste.
Published: 2009-01-21Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.