SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Electronic Solder, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The solder used in energy storage modules is extremely sensitive to voiding rate. Low-void solder paste can control the voiding rate of BGA solder joints within 5%, significantly improving the thermal fatigue life of electronic control boards under high-power cycling. Jiajinyuan JY-810A solder paste, with its stable thixotropy, low residue, and reflow wetting angle of less than 25°, has become a practical combination for BGA soldering of electronic control boards in the selection of solder materials for energy storage modules.
Published: 2017-04-04To address the issue of solder joint cracking caused by concentrated thermal stress in energy storage new energy electronic control boards during frequent charge-discharge cycles, solder paste with high ductility, low elastic modulus, and excellent thermal cycle life must be selected. New energy solder paste must pass thermal shock verification at -40℃ to 125℃ for more than 1000 cycles, while reliability solder paste emphasizes the uniformity of the IMC layer and the stability of the Cu6Sn5 phase. The metal content, particle size distribution, and flux residue ion concentration of the solder paste jointly determine its long-term thermal fatigue resistance.
Published: 2016-07-02RoHS solder is a mandatory access threshold for the export of foreign trade electronic products. Jia Jinyuan RoHS solder has passed all SGS tests, with lead content <100ppm, cadmium <50ppm, and hexavalent chromium <1000ppm, fully meeting the requirements of the EU RoHS 2.0 Directive and the US CPSIA. It has completed full-process verification of solder paste printing, reflow soldering, and AOI inspection on the production lines of 37 OEM factories in Shenzhen, Dongguan, Suzhou and other places.
Published: 2015-11-12Domestic solder has achieved full-process controllability from material formulation to batch stability, supports customers in small-batch sample trial and prototyping, and is widely adapted to scenarios such as new energy vehicle BMS modules, high-reliability PCBA for medical monitors, and consumer fast-charging boards. It can maintain 4-hour printing stability under workshop temperature control of 25℃~30℃. The thixotropic index of Jia Jinyuan solder paste reaches 0.72, with a viscosity recovery rate ≤15%, fully meeting the fine printing requirements of 0201 components and 0.3mm pitch QFN.
Published: 2015-10-22Automotive electronic solder must meet the long-term reliability requirements of vehicle-mounted circuit boards under high-temperature, high-humidity, and strong-vibration environments. Jiajinyuan automotive electronic solder adopts a low-silver lead-free formula, delivers stable wettability at a peak reflow temperature of 260℃, controls the IMC layer thickness within the range of 3.2～4.8μm, effectively suppresses solder joint crack propagation, has obtained AEC-Q200 certification, and is used in mass production on ADAS domain controller PCBA production lines.
Published: 2015-08-30Consumer electronics solder faces the dual challenges of solder bead residue and high solder joint void rate in SMT production lines. Jiajinyuan low-solder-bead low-void consumer electronics solder optimizes the metal powder particle size distribution and flux activity ratio, reducing the number of post-soldering solder beads for 0201 components to ≤3 per square centimeter and stably controlling the BGA solder joint void rate at ≤8%, significantly improving the first-pass yield of consumer electronics solder on high-density PCBs.
Published: 2014-03-19Lead-free and halogen-free solder options for electronics manufacturing have become mainstream. Jiajinyuan provides dual-system lead-free solders: Sn96.5Ag3.0Cu0.5 and Sn99.3Cu0.7, while also supporting halogen-free formulations with Br < 900 ppm and Cl < 900 ppm, meeting the full requirements of IEC 61249-2-21, JPCA-ES-01-2021, and RoHS3, and adapting to different product standards for consumer electronics, automotive electronics, and medical devices.
Published: 2013-08-12
Common failures of soldering consumables in electronics factories directly hit production line pain points, covering solder paste printing misalignment, collapse, oxidation and skinning, solder wire soldering spatter, icicle formation, poor wetting, insufficient activity of soldering paste and whitening residue, etc. Combined with 20 years of SMT practical experience, immediately executable parameter adjustment and material control solutions are provided.
Published: 2012-04-18Automotive electronic solder is prone to microcracks and interfacial delamination during high-low temperature cycling. The sample testing service provided by JJY can realistically simulate solder joint reliability under conditions of -40℃ to 125℃ and 500 cycles, helping production lines quickly verify the compatibility of solder with PCB pads and component terminals, and avoid functional failures after batch soldering.
Published: 2012-03-11To address high-frequency defects such as cold solder joints, tombstoning, and misalignment when soldering 01005 components on precision small boards in consumer electronics, this solution focuses on stencil aperture optimization, solder paste rheological property matching, and closed-loop control of the Z-axis pressure of the placement machine. By reducing the stencil thickness from 0.1mm to 0.08mm and matching it with the Jiajinyuan J-105F solder paste with a thixotropic index of 2.35, the first-pass soldering yield of 01005 components is increased from 82.6% to 97.3%, while avoiding the risk of pad peeling caused by excessive squeegee pressure.
Published: 2012-01-23Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.