SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Electronic Solder, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The electronics manufacturing exhibition held at the Shanghai New International Expo Centre from January 15 to 17, 2026, showcased substantial progress in SMT solders in areas such as high reliability, low-temperature lead-free technology, and fine-pitch compatibility. Multiple leading material manufacturers released new SMT solders tailored for Chiplet packaging and automotive PCBs. The industry consensus is shifting from purely compositional optimization toward the coordinated verification of process compatibility and long-term thermomechanical stability.
Published: 2026-02-21
Addressing the industry pain point that solder joints on new energy electronic control boards are prone to cracking and have insufficient reliability under high-low temperature cycling conditions, Jiajinyuan has launched a variety of halogen-free and lead-free high-temperature solder pastes, covering segmented scenarios such as high solder climb for QFN/DFN, low void rate, zero halogen, and laser welding. Its 0307, 305 and other alloy systems at 240
Published: 2026-01-04The bulk procurement of solder for the electronics factory adopts the direct supply model from Jiajinyuan Factory, eliminating intermediaries to reduce the unit price by 12%~18%. Combined with VMI inventory collaboration and batch traceability system, the solder turnover cycle of the SMT production line is compressed to 4.2 days, significantly alleviating the capital occupation of solder and the pressure of emergency replenishment for the electronics factory.
Published: 2025-12-31Medical electronic equipment has extremely stringent requirements for the purity, ionic residue and long-term reliability of solder materials. With its strictly controlled metal composition, low halogen content and batch stability, ISO solder materials have become the first choice for SMT production lines of implantable and monitoring devices. Jiajinyuan ISO solder materials have passed the biocompatibility pre-assessment of IEC 60601-1 Appendix A. In actual production lines, the ionic residue on the board surface after reflow is <0.85μg/cm2, and the copper mirror corrosion test shows no discoloration for over 72 hours.
Published: 2025-01-15Automotive electronic solder maintains the mechanical strength of solder joints within a wide temperature range of -40°C to 150°C, and shows no microcracks after random vibration tests at 20G acceleration and 10Hz–2kHz, meeting the dual requirements of temperature resistance and vibration resistance for automotive electronic solder in high-reliability scenarios such as ADAS controllers and BMS main control boards.
Published: 2024-06-29Soldering on ENIG boards imposes extremely stringent requirements on the halogen residue, wettability, and residue insulation of solder paste. Halogen-free solder paste stands out in preventing excessive dissolution of the gold layer, reducing leakage current during ICT testing, and improving long-term reliability. Jiajinyuan's halogen-free solder paste has been validated on multiple high-end HDI board production lines, demonstrating stable printability under 0.3mm pitch QFN and 0.4mm BGA packages, along with an actual void rate of <8%.
Published: 2023-07-11Lead-free solder for consumer electronics has become a mandatory threshold for export. Jiajinyuan lead-free solder strictly meets the requirements of RoHS and JEDEC J-STD-006 in terms of melting point, wettability, and IMC growth rate. Measured at a reflow peak temperature of 235℃±2℃, the solder joint thrust reaches 4.8N, the void rate is below 12%, and the copper PAD corrosion depth is <0.8μm, fully satisfying the full-lifecycle environmental compliance requirements of EU CE, US FCC, and Japanese JIS for consumer electronics solder.
Published: 2023-05-17Running solder samples on machines at an electronics factory is a key action to verify the compatibility of new solder batches with existing SMT production lines. By running small-batch trial production in real environments with stencils, placement machines, and reflow ovens, adaptation issues such as poor printing release, placement offset, and reflow cold soldering can be quickly identified, avoiding rework after the entire batch of materials goes online. The batch stability, thixotropy, and activity of electronics factory solder must be cross-verified through actual production line testing.
Published: 2022-12-25QFN soldering on new energy electronic control boards faces dual challenges of high-frequency vibration and thermal cycling. By optimizing stencil aperture design, reflow profile, and pad design, Jiajinyuan has increased the thrust of QFN solder joints to over 28N, with the IMC layer thickness controlled at 3.2μm±0.4μm, effectively suppressing microcrack propagation and meeting the long-term reliability requirements of automotive-grade IPX7 protection and operating conditions ranging from -40℃ to 125℃.
Published: 2022-12-11The pin dip soldering lead-free alloy process, by precisely controlling dip soldering temperature, time, and alloy composition ratio, effectively avoids the ROHS compliance risks of traditional lead-containing processes. It has been stably operating on multiple export production lines of JJY for over three years, with its solder joint wettability, thermal fatigue resistance, and surface gloss all meeting the requirements of the IEC61191-2 standard.
Published: 2022-02-12Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.