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JJY, through its full range of halogen-free and lead-free high-temperature, medium-temperature, low-temperature, and laser-specific solder paste products, strictly controls wastewater and exhaust emissions during production, and realizes closed-loop management of green electronic materials from material formulation and alloy powder grading to rosin/washable processes. Its 12 major series of solder pastes, including 8MQP/5RQ, have halogen
Published: 2022-01-26
In 2021, the application of low-temperature solder paste in the consumer electronics field gradually expanded, mainly due to its advantages in protecting precision components and its soldering compatibility, making it an important factor driving the technological upgrading of the industry.
Published: 2021-12-30Connector solder is specifically designed for welding various electronic connector terminals, featuring excellent wettability, low void rate, and strong thermal shock resistance. It is suitable for high-density connection scenarios such as FPC, board-to-board, and wire-to-board, and exhibits stable thrust and low cold solder joint rate in both reflow soldering and selective wave soldering processes, making it a critical solder material for ensuring the long-term insertion and removal reliability and signal integrity of connectors.
Published: 2021-08-28
When choosing between syringe-packaged and bottled solder paste for mobile phone repair, the key factors are work precision, reapplication frequency, and solder ball control capability. Syringe packaging delivers stable paste output in high-precision electronic repair scenarios such as BGA ball mounting and flying wire soldering, and is less likely to contaminate PCBs. Bottled solder paste, while lower in cost, is prone to oxidation and introduces more impurities during dipping, which in turn increases the rate of cold solder joints and rework over long-term use.
Published: 2020-11-10Voids can easily cause fatal defects such as cold solder joints, bridging, and BGA cracking in the SMT process of new energy, medical, and communication electronic products. Production line data from Jia Jinyuan shows that the failure rate of BGA devices with a void rate exceeding 8% increases by 3.2 times. Closed-loop control must be achieved through stencil aperture optimization, dynamic calibration of squeegee pressure, and real-time monitoring of nitrogen purity.
Published: 2020-10-04The selection and control of solder materials in electronics manufacturing directly determine the first-pass yield of PCBA. The metal content, viscosity, and slump resistance of solder paste must match the stencil apertures, reflow profile, and component density of the production line. Jia Jinyuan solder paste performs excellently in 0.3mm pitch QFN printing, while solder wire and solder bar require focused monitoring of rosin residue and wetting angle consistency.
Published: 2020-08-29This paper focuses on the practical application of sensor solders in the SMT process of electronic sensor PCBs, covering the solder selection logic for common sensors such as thermal sensors, pressure sensors, and acceleration sensors, key points for reflow profile adaptation, and production line-level troubleshooting paths for cold solder joints and missed solder joints. It emphasizes the differentiated performance of two sensor solders, Jiajinyuan SN100C and SN63Pb37, in terms of wettability, residue activity, and thermal shock resistance.
Published: 2020-05-08To address common issues such as cold soldering, poor wetting, and solder beads that frequently occur in the high-volume production of consumer electronics motherboards with OSP boards, this solution is based on measured production line data from Jia Jinyuan, focusing on four key measures: stencil aperture optimization, dynamic nitrogen concentration control, reflow oven temperature zone gradient matching, and AOI false alarm rate reduction. It stably improves the first-pass yield of OSP board soldering to 99.23%, with a single-line daily output exceeding 8500 units.
Published: 2020-02-17Supply from domestic factories for consumer electronics solder has achieved stable batch delivery. Jiajinyuan solder meets first-tier production line requirements in terms of Sn-Ag-Cu series alloy composition control, oxide layer suppression process, and batch consistency. Under the same specifications, its quotation is 18% to 22% lower than that of imported brands, and it supports weekly rolling production scheduling and 48-hour emergency shipment, significantly alleviating the risk of line changeover downtime caused by solder supply disruption on SMT production lines.
Published: 2019-09-08
In 2018, a trend of solder paste formula optimization emerged in the electronics manufacturing industry, and enterprises began to pay attention to the application scenarios of environmentally friendly and low-residue solder pastes. With increasingly strict environmental regulations and rising industry demand for high-precision manufacturing, solder paste technology is gradually developing in the direction of low harmful substances and high stability.
Published: 2019-01-01Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.