Consumer electronics SMT production has stringent requirements for solder paste's wetting rate, residue transparency, halogen content and thermal stability. Domestic solder paste has achieved full-scenario coverage from QFN/DFN high-density packaging to precision terminals such as mobile phones, tablets and Bluetooth devices. The 8MQP/5RQ series has a wetting rate close to 100%, the 8MNTTP/5RNTT series has halogen content as low as 100~200ppm, and the 8M9P/5RR series is halogen-free with extremely low void rate, truly supporting the process confidence for the domestic substitution of consumer electronics solder paste and SMT solder paste.

Based on 20 years of practical experience in SMT production lines, this article provides an in-depth analysis of the application scenarios and process performance of 12 mainstream domestic solder pastes, covering key metrics such as QNP solder fillet formation rate, void control, residue transparency, and water wash compatibility. It focuses on comparing the real-world performance of models including 8MQP/5RQ, 8M9P/5RR, and 8MNTTP/5RNTT in high-demand scenarios such as communication equipment, automotive lighting, and fingerprint locks, providing actionable solder paste evaluation basis for SMT solder paste selection.

The practical performance of high-activity solder paste in achieving nearly 100% solder wetting rate for fine-pitch QFN/DFN devices directly determines the success or failure of domestic solder paste brand selection. Based on the measured data of Jia Jinyuan LFP-JJY series halogen-free and lead-free high-temperature solder paste, this paper compares the differences in residue transparency, halogen content, and alloy powder particle size distribution among models including 8MQP/5RQ, 8MTSP/5RTS, and 8MNTTP/5RNTT in the reflow soldering solder paste process, providing a directly applicable domestic solder paste replacement solution for SMT production lines.

Poor solder wetting on pads often stems from insufficient solder paste activity, unreasonable alloy powder particle size distribution, or halogen residue inhibiting wetting. This domestic solder paste, through the synergistic optimization of 0307/305 alloy powder T4 fineness, ROL0 ultra-low halogen (<500ppm) and rosin-based carrier, significantly improves the QFN/DFN solder climbing rate to 70%–90%, and is a cost-effective solution to replace imported SMT solder paste and achieve stable mass production of solder paste with good solderability.

Solder paste spattering during reflow soldering is mostly caused by printing misalignment, unreasonable stencil aperture design, excessive squeegee pressure, or sudden changes in solder paste viscosity. Selecting anti-spattering solder paste with high thixotropy and low spattering tendency can significantly improve the issue. Domestic solder pastes such as Jiajinyuan LFP-JJY5RNTT-0307 (halogen 100~200ppm) and LFP-JJY5RR-0307 (halogen-free) deliver stable performance in QFN solder wetting rate and void control, making them a cost-effective alternative to imported reflow soldering solder pastes.

Low-silver solder paste significantly reduces material costs while ensuring soldering reliability. SMT solder paste selection must balance wetting rate, void rate, and residue characteristics. Domestic solder pastes such as the 8MQP/5RQ and 8MNTTP/5RNTT series, with their 0307/305 alloy powder, ROL0-level halogen control, and T4/T5 fine powder distribution, achieve cost-effective substitution in QFN/DFN packages and high-precision consumer electronics.

SAC305 solder paste is the mainstream lead-free solder paste. Its melting point of 217°C and soldering window of 235–255°C are compatible with most reflow processes. Domestic solder paste brands such as Jiajinyuan LFP-JJY5RQ-305, LFP-JJY5RR-305 and LFP-JJY5RNTT-305 stand out in halogen control, wetting ability and void rate, balancing high activity and low residue, and have become a reliable alternative for QFN/DFN packaging, automotive electronics and other scenarios.

SnBi solder paste has become a key material for soldering heat-sensitive components due to its low melting point of 138–172℃. Domestic solder paste has achieved mass production of mature formulations such as Sn42Bi58 and Sn64Bi35Ag1 in the low-temperature solder paste field. The Jiajinyuan LFP-JJY2R-64351 and LFP-JJY5RW1A-4258 series have verified process stability in printability, wettability and low void rate in scenarios such as LED transparent screens, copper wire lamps and aluminum nickel-plated heat sinks.

This article summarizes 12 mainstream domestic solder paste series, covering the full-scenario requirements of SMT soldering solder paste, including high solder climbing rate for QFN/DFN, low voidage for automotive lamps, laser dispensing compatibility, soldering of stainless steel and aluminum, and ultra-low temperature packaging. It focuses on analyzing the practical differences of the Jiajinyuan LFP-JJY series in halogen control, alloy powder particle size distribution, and T3-T7 particle size selection, providing production-line-level parameter basis for chip solder paste selection.

Facing the practical pain points of imported solder paste such as long delivery cycles, high costs, and slow technical support response, domestic solder paste has achieved full-scenario coverage, from high solder climbing rate in QFN/DFN, zero-halogen low voiding, laser dispensing compatibility to water washability. The LFP-JJY series SMT solder paste, through 0307/305/T4-T4 alloy powder systems and ROL0-level halogen control, has become a reliable alternative to imported solder paste.

In response to the stringent requirements of SMT production lines for stably stored solder paste, this paper, based on the measured performance of Jiajinyuan domestic solder paste, focuses on recommending three high-stability rosin-based halogen-free lead-free high-temperature solder pastes: 8MQP/5RQ, 8MNTTP/5RNTT, and 8M9P/5RR. They can be stably stored at 25℃ for 6 months without oil separation or stratification, and the T4/T5 fine powder ratio balances printability and reflow wetting ability, making them a reliable choice to replace imported SMT solder paste.

Domestic solder paste has achieved key breakthroughs in the field of temperature-stabilized solder paste. With 0307/305 alloy powder T4-grade fineness, ROL0-grade ultra-low halogen residue and rosin-based system, Jiajinyuan LFP-JJY5RQ and 5RNTT series have demonstrated excellent temperature recovery stability and delamination resistance in actual tests where the QFN solder climbing rate is nearly 100% and the void rate after reflow is below 8%, making them a cost-effective choice for replacing imported products in SMT solder paste production lines.

Dispensing solder paste, dot solder paste, and domestic solder paste must strictly match the process

Communication motherboards have extremely high requirements for solder paste's wetting ability, residue transparency, and halogen control. The 8MNTTP/5RNTT series communication board solder paste launched by domestic solder paste brand Jiajinyuan contains only 100~200ppm halogen, with minimal and transparent residue. It is compatible with high-density packages such as QFN/DFN, and achieves high-reliability solder paste performance when paired with 00507BN/T5 ultra-fine powder. It has been batch-verified on 5G base station motherboards.

To meet the high-reliability soldering requirements of automotive electronics, this paper recommends several domestic solder pastes suitable for key working conditions such as QFN/DFN solder climbing, low void rate, and zero halogen. Covering 8MQP/5RQ, 8M9P/5RR and other series, it balances high-temperature reflow stability and residue transparency, providing a selection basis for automotive solder pastes that can be directly introduced into production lines for the domestic substitution of electronic solders.

For R&D sample prototyping scenarios, multiple small-packaged domestic solder pastes are recommended, covering types such as halogen-free lead-free high-temperature, zero-halogen, water-washable, and laser-specific. Among them, the 8MQP/5RQ series has a solder wetting rate close to 100%, and the 8M9P/5RR achieves 0ppm halogen content and an extremely low void rate, making it particularly suitable for high-demand working conditions such as QFN/DFN packages and automotive lighting. All models support 10g/20g/50g small packages, meeting the three core demands of prototyping solder paste, small-packaged solder paste, and domestic solder paste.

Insufficient solder paste volume on low-solder pads is the main cause of high-frequency cold soldering defects in SMT production lines, directly resulting in poor solder joint wetting, increased void rate, and failed thrust tests. When Jiajinyuan solder paste is printed through a 0.12mm thick stencil, if the squeegee pressure is below 4.5kg and the speed exceeds 40mm/s, discontinuous solder volume is extremely likely to form on the edges of 0.3mm pitch QFN pads, requiring simultaneous adjustment of the release speed and PCB support flatness.

500g canned solder paste balances material change frequency and waste control in SMT production lines. The domestic solder paste brand Jiajinyuan's multiple series of halogen-free, lead-free high-temperature solder pastes cover scenarios such as QFN solder climbing, low voidage in automotive lamps, and high-precision communication applications. Its models including 8MQP/5RQ, 8MNTTP/5RNTT, and 8M9P/5RR stand out in T3-T5 alloy powder particle size distribution, halogen content ranging from 100~200ppm to 0ppm, and residue transparency, making them a cost-effective alternative to imported SMT solder pastes.

To meet the stringent requirements of SMT production lines for solder paste with stable viscosity, several domestic solder pastes are recommended, covering types such as halogen-free and lead-free high-temperature, zero-halogen, water-washable, and laser-specific. Among them, the 8MQP/5RQ and 8MNTTP/5RNTT series stand out in terms of QFN solder climbing rate, residue transparency, and halogen control, making them preferred SMT solder pastes that balance viscosity stability and process adaptability.

To meet stringent requirements in high-density PCB soldering such as fine pitch, high solder climb rate, and low void rate, multiple domestic halogen-free, lead-free high-temperature solder pastes compatible with T3/T4/T5 grade fine powder solder pastes are recommended, covering high-activity scenarios for QFN/DFN, precision placement in communications and consumer electronics, low-void thermal management for automotive lamps, and special models for laser dispensing. All products use 0307/305 alloy powders with a measured melting point of 217–227℃, balancing printability, wettability, and residue transparency.