Domestic Solder Pastes have formed a complete matrix covering high-temperature, medium-temperature, low-temperature and special processes. Among them, our JJY LFP-JJY series has solid applications in the field of SMT Soldering Solder Pastes. For example, the 8MQP/5RQ model adopts 0307/105/305 alloy powder T3-T5 grading, combined with the ROL1 standard of single halogen <900ppm, which is especially suitable for production line scenarios where QFN/DFN devices require nearly 100% solder wetting. The 8MNTTP/5RNTT reduces halogen to the ROL0 level of 100~200ppm, paired with micro-refined alloy powders such as 00507BN and 00507B2N. In high-precision SMT Solder Paste applications such as mobile phone motherboards and fingerprint lock modules, it leaves little and transparent residue, avoiding false ICT probe judgments.

In response to the stringent requirements of automotive electronics for void rate, the 8M9P/5RR series achieves dual compliance of 0ppm halogen and extremely low void rate. Its 305 alloy powder T3-T5 structure can effectively inhibit abnormal growth of the IMC layer within the 235~255℃ soldering window, and has been batch-verified on LED vehicle lamp heat dissipation substrates. The 8MW5/5RW5 water-washable solder paste performs excellently when soldering stainless steel and nickel-plated aluminum fins. The SC07 and Sn42Bi58 mixed powder ensures that residues can be removed with water after low-temperature soldering at 160~185℃, completely avoiding the risk of capillary leakage caused by organic solvent cleaning.

Laser welding-specific solder pastes such as the 5RLJ and 5RLJB series not only adapt to the micron-level dispensing accuracy of pneumatic valves, screw valves and jet valves, but also achieve more uniform laser beam energy absorption through the gradient distribution of 00507BN/00507B2N and Sn64.7Bi35Ag0.3 alloy powder T5-T7. The solder ball defect rate is lower than 0.02%. After replacing the traditional hot air gun solution in pneumatic valve PCBA rework, the yield increased by 12.7%. As for ultra-low temperature packaging scenarios, the 5RG series adopts In52Sn48 alloy powder T5-T7, completes soldering at 110~130℃ without damaging flexible substrates. Combined with the 0ppm halogen design, it has been stably operating for more than 18 months at the TWS earphone battery FPC bonding station.

Conventional lighting LED production lines mostly choose the 8MA series. Its combination of SC07 and 0307 alloy powder T3-T4 balances wettability and cost, and the residue transparency meets AOI inspection requirements. The 8MW1P/5RW1 water-washable high-temperature solder paste replaces no-clean types in high-power power modules, reducing single-board cleaning costs by 37%. However, it should be noted that an excessively high proportion of T3 powder easily causes stencil clogging. It is recommended to clean the squeegee edge every 25 boards during the printing cycle. All series use a rosin-based Flux system, except for 8MW1A and 8MW5 which are water-washable. The latter, due to proper control of Ni element precipitation during aluminum soldering, maintains solder joint shear strength above 22.3MPa, far exceeding the 18MPa baseline for aluminum substrates specified in IPC-J-STD-004B.