Since last year, the production line has been conducting batch verification of the LFP-JJY5RQ-0307 halogen-free and lead-free high-temperature Solder Paste. It has been found that after printing on QFN packages with 0.4mm pitch, its solder wetting rate remains stably above 95%. Meanwhile, the post-reflow residue is transparent and requires no additional cleaning. Compared with a previously used Japanese imported solder paste under the same stencil aperture design, the wetting rate is improved by approximately 8 percentage points, and the squeegee life is extended by around 12%. The root cause lies in its T4-grade 0307 alloy powder having a more concentrated particle size distribution and the rosin Flux carrier releasing activity in a more controlled manner.

To meet the stringent void rate requirements of automotive lighting boards, the LFP-JJY5RR-0307 zero-halogen and REACH-compliant lead-free high-temperature solder paste has a measured solder joint void rate below 1.8% at a peak temperature of 245°C. When combined with nitrogen-protected reflow, the void rate can be reduced to 1.2%. Under the same reflow profile, comparable imported competitors exhibit void fluctuations ranging from 2.1% to 2.9%. This difference primarily stems from its ROL0-grade halogen control and optimized flux volatilization gradient, which enables more sufficient degassing of the solder paste near the liquidus temperature.

When manufacturing fingerprint lock motherboards, cold solder joints caused by oxidized BTB connector pads were encountered. After switching to the LFP-JJY5RNTT-305, the issue was completely resolved. This model contains 00507B2N alloy powder and an even lower halogen content of 100ppm. It activates interfacial reactions during the 160°C preheating stage, completing wetting and spreading approximately 12 seconds earlier than conventional 305 solder pastes. Microscopic observation reveals significantly improved edge continuity of the solder joints, and the first-pass yield of ICT testing increased from 92.3% to 99.1%.

Soldering of LED heat-dissipating aluminum substrates has long relied on imported low-temperature solder pastes. However, the LFP-JJY2R-64351 achieves equivalent wetting performance at a peak temperature of 195°C. The Sn64Bi35Ag1 alloy has an onset melting point of only 151°C. Combined with T3-grade powder, the printing release rate is improved to 99.6%. Furthermore, stencil cleaning frequency has been reduced from every 5 boards to every 12 boards. Production line feedback indicates that its thixotropy better matches the squeegee pressure response curve of domestic fully automatic printers.

In laser jet dispensing scenarios, imported laser-specific solder pastes were previously mandatory. However, the LFP-JJY5RLJ-305 exhibits no solder balls or splashing under a 30W fiber laser. The T6-grade 305 powder enhances melting consistency, with the dispensing volume CV value controlled within ±2.3%. Measured data differs by only 0.4 percentage points from a certain German imported material, while the cost per kilogram is reduced by 37%. It also supports dual-mode switching between pneumatic valves and screw valves.

For water-washing process lines, there were previously concerns about insufficient cleaning of Domestic Solder Pastes. After 60 seconds of pure water spraying at 55°C, the ionic contamination level of the LFP-JJY5RW1-0307 is <0.78μg/cm² NaCl, meeting the IPC-J-STD-001E Class 2 standard. It reaches the standard 15 seconds faster than a certain Taiwanese water-washable solder paste. The key is that the decomposition temperature window of its ORH1-type water-soluble flux has a higher degree of matching with the conveyor speed of the cleaning machine.