The TLP-7RN series of dedicated Leaded Solder Pastes for QFN, including two models TLP-7RN-62836804 and TLP-7RN-6337, are specialized Soldering Materials developed by JiajinYuan to address the soldering challenges of QFN (Quad Flat No-lead) packaged devices. The soldering of the large-area pad at the bottom of QFN packages and the surrounding fine-pitch terminals imposes extremely high requirements on the printing accuracy and solder climbing performance of the Solder Paste.

By optimizing the sphericity and particle size distribution of the solder powder, combined with a specially formulated Flux activation system, this series of solder paste achieves excellent solder climbing performance on both the bottom thermal pad and the surrounding signal terminals of QFN. During Reflow Soldering, the flux can effectively remove the oxide layer on the pads, allowing the molten alloy to form full and uniform solder joints on the QFN terminals.

TLP-7RN-62836804 adopts a SnPb alloy system with a moderate melting point and a wide soldering process window, enabling it to adapt to different reflow profile settings. TLP-7RN-6337 is designed for QFN devices with finer pitches; by optimizing the flux viscosity and thixotropy, it ensures stable release during stencil printing and precise control of solder volume.

Measured data shows that when soldering 0.4mm pitch QFN devices, the solder climbing height of this series of solder paste can reach more than 75% of the terminal height, and the solder joint void rate is below 15%, which can significantly improve the soldering yield and long-term reliability of QFN packages. It is suitable for QFN device assembly in high-reliability electronic products such as servers, network communications, and industrial control.