The stencil aperture is fine, but insufficient Solder Paste always occurs during printing. This situation often confuses engineers; in fact, the problem may not necessarily lie with the stencil.

First, check whether the viscosity of the solder paste is appropriate. If the viscosity is too low, the solder paste is easily carried away by the squeegee during printing, resulting in insufficient solder. In this case, it is necessary to replace the solder paste with a higher viscosity.

Secondly, consider whether the squeegee pressure is set reasonably. Too little pressure will cause the solder paste to fail to fully fill the stencil apertures, while too much pressure may cause the solder paste to be squeezed out. Adjusting the squeegee pressure to the optimal range is key.

The printing speed also affects the distribution of the solder paste. Too fast a speed will prevent the solder paste from fully filling the apertures, while too slow a speed may increase the risk of contamination. Optimizing the printing speed according to actual conditions can effectively improve the insufficient solder problem.

Finally, pay attention to the storage and usage methods of the solder paste. If the solder paste is not used in time after being opened or is stored improperly, its performance may deteriorate. Regularly check the status of the solder paste to ensure it is in the best working condition.

The above measures can directly solve most insufficient solder problems, but they need to be flexibly adjusted in combination with actual production conditions.