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Here you can find knowledge about Soldering Material, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Addressing the local soldering challenges of industrial control board connectors, selective wave soldering achieves high-reliability soldering through precise temperature control and solder wave positioning, while avoiding overheating damage to sensitive components across the entire board. Jiajinyuan equipment stably achieves a 99.7% first-pass yield under conditions of 0.8mm pin pitch and 12mm pad length, with a process window widened by 35% compared to traditional wave soldering, making it particularly suitable for the mixed assembly requirements of multilayer boards + high-density connectors in domestic substitution.
Published: 2010-08-27
High impurity content in solder bars directly causes typical wave soldering defects such as solder spikes, bridging, and cold soldering. Elements such as copper, iron, and arsenic in solder impurities not only reduce wettability, but also accelerate oxidation of the solder pot and clog the nozzles, seriously affecting the line throughput yield and the service life of the solder bars.
Published: 2010-08-24The QFN soldering process requires precise control of solder paste volume, stencil aperture, and reflow profile. Actual measurements on Jia Jinyuan's production line show that a 0.12mm-thick stencil with 30μm trapezoidal apertures can effectively inhibit cold solder joints and bridging. Combined with reflow parameters of a peak temperature of 235℃±2℃ under nitrogen protection and a time above liquidus of 65 seconds, the first-pass yield of QFN soldering is stably maintained above 99.2%.
Published: 2010-06-17The direct supply model from domestic factories for solder auxiliary materials significantly reduces intermediate costs. Jiajinyuan's full range of solder auxiliary materials, including solder paste, flux, and cleaning agents, supports orders starting from 100kg. The unit price for bulk purchases is 18% to 25% lower than that of traders, and the delivery cycle is shortened to within 7 working days, meeting the needs of high-frequency replenishment and urgent changeovers on SMT production lines.
Published: 2010-05-25In the actual production line application of ISO solder materials, the melting point deviation between batches is controlled within ±1.2℃, and the fluctuation of active residue is less than 0.03%. This is attributed to Jia Jinyuan's decomposition of ISO 9001 clauses item by item into 27 executable actions, including smelting temperature recording frequency, alloy composition quick inspection response time, and packaging sealing sampling proportion, ensuring that each batch of ISO solder materials is fully controlled from feeding to outbound.
Published: 2010-04-26Solder used in electronics manufacturing plants must achieve dynamic matching across all processes including SMT placement, wave soldering, and touch-up soldering. Jiajinyuan solder adapts to complex thermal stress scenarios with reflow peak temperature of 235℃, wave soldering temperature of 260℃, and manual touch-up soldering instantaneous temperature of 380℃ through melting point gradient design. Its active residue content is controlled within 0.012%, avoiding ICT test leakage and excessive ion contamination.
Published: 2010-03-28X-Ray inspection can penetrate BGA packages to directly observe solder ball morphology, void distribution, and bridging defects, making it an irreplaceable method for verifying the internal quality of reballing soldering after rework. Especially after reballing operations are completed on JJY rework stations, X-Ray inspection must be performed to confirm whether solder ball coplanarity, offset, and void rate comply with IPC-A-610 Class 2 standards.
Published: 2010-02-27Cold soldering is one of the most hidden and stubborn soldering defects in SMT production lines. It is often induced by a combination of non-compliant reflow temperature profiles and excessive PCB heat capacity, resulting in insufficient melting of solder paste, poor wetting of solder joints, and insufficient thrust. In Jiajinyuan cold soldering cases, 83% stem from a reflow zone peak temperature below 217℃ and a heating ramp rate lower than 1.5℃/s.
Published: 2010-02-04High-frequency PCB soldering is a core step in 5G high-frequency PCB SMT soldering, which directly determines signal integrity and transmission stability in the millimeter-wave frequency band. Jiajinyuan has verified on substrates including FR4, Rogers, and Taconic that the solder paste filling rate of 0.15mm micro-via pads is >92%, and the post-reflow coplanarity is ≤18μm. By optimizing squeegee pressure and trapezoidal compensation for stencil apertures, the high-frequency PCB soldering yield is stably maintained above 99.3%.
Published: 2010-01-11Cold solder joint is a fatal defect common to wave soldering and SMT reflow soldering, with causes spanning multiple stages such as solder paste printing misalignment, oven temperature profile mismatch, PCB pad oxidation, insufficient flux activity, and conveyor speed fluctuations. Jia Jinyuan production line data shows that over 65% of soldering defects caused by cold solder joints stem from insufficient preheating and deteriorated interfacial wetting when nitrogen purity is below 99.99%.
Published: 2009-11-12Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.