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Cold soldering problems often stem from the fact that the actual peak temperature of the reflow oven fails to reach the solder paste activity window. Production line verification by Jiajinyuan shows that conducting oven temperature tests at least once a week can stably control the cold soldering defect rate within 300ppm. The fluctuation range of each temperature zone is measured using a KIC temperature profiler to ensure sufficient solder paste melting and that the thickness of the intermetallic compound (IMC) layer meets the standard.
Published: 2009-06-07Multiple factories have tested and confirmed that domestic solder paste performs stably in reflow soldering applications. The 8MQP/5RQ series achieves a solder climbing rate close to 100%, the 8MNTTP/5RNTT series has a halogen content as low as 100~200ppm, and the 8M9P/5RR series delivers 0ppm zero halogen and extremely low voidage. These products cover scenarios including QFN/DFN, automotive lighting, high-precision communications, and ultra-low temperature laser welding. Domestic SMT solder paste replacement now has full temperature range and full process adaptability.
Published: 2009-05-19Multiple domestic solder pastes were tested for key indicators including QFN solder climb rate, void control, and residue transparency. PCB solder paste selection must match the specific process window. The activity of soldering paste is inversely proportional to its halogen content. Domestic solder pastes now cover the full gradient from zero-halogen ROL0 to halogen-free ROL1. 8M9P/5RR achieves automotive lighting-grade low void rates, while 8MNTTP/5RNTT achieves over 90% solder climb on high-density pads of mobile phone motherboards.
Published: 2009-04-25This article summarizes 12 mainstream domestic solder paste series, covering the full-scenario requirements of SMT soldering solder paste, including high solder climbing rate for QFN/DFN, low voidage for automotive lamps, laser dispensing compatibility, soldering of stainless steel and aluminum, and ultra-low temperature packaging. It focuses on analyzing the practical differences of the Jiajinyuan LFP-JJY series in halogen control, alloy powder particle size distribution, and T3-T7 particle size selection, providing production-line-level parameter basis for chip solder paste selection.
Published: 2009-03-18
Whether solder paste contains halogens is directly related to the long-term reliability and environmental compliance of PCBA. Halogen-free solder paste requires the total halogen content to be below 900ppm. Detection needs to combine ion chromatography and sample pretreatment processes. Production lines often suffer from misjudgments due to neglecting extraction temperature control or errors in standard solution preparation.
Published: 2009-03-14QFN package soldering places extremely high requirements on the solder paste's wetting ability, void rate, and residue. The zero-halogen solder paste of the 8M9P/5RR series launched by domestic solder paste brand Jiajinyuan achieves an extremely low void rate. When paired with 0307T4 alloy powder, it forms stably within the 240–255℃ reflow window. Meanwhile, the 8MQP/5RQ series achieves nearly 100% wetting for QFN solder paste thanks to its high activity, making it a key practical option for low-void solder paste and for domestic solder paste to replace imported alternatives.
Published: 2009-02-22To improve yield, solder paste must be matched to the specific pain points of the production line. Domestic solder pastes such as the 8MQP/5RQ series achieve a near-100% solder climbing rate on QFN/DFN packages. The 8MNTTP/5RNTT series has a halogen content as low as 100~200ppm, making it suitable for high-precision scenarios in mobile phones and fingerprint locks. The 8M9P/5RR achieves zero halogen and an extremely low void rate, truly supporting the practical implementation of domestic substitution for SMT solder paste.
Published: 2009-02-10Post-welding insulation impedance compliance depends on the ionic cleanliness of solder paste residues and the compactness of the formed film. Domestic high-insulation solder pastes, through strict halogen control (ROL0 grade <500ppm), optimized rosin matrix and T4/T5 fine powder ratio, achieve 70%~100% solder wetting rate for QFN/DFN while ensuring the impedance between reflow solder paste joints is >10^9Ω. Series including LFP-JJY5RNTT, 5RR and 5RLJ have been mass-applied in communication module and automotive LED production lines.
Published: 2009-01-19For high-frequency soldering defects on SMT production lines such as poor QFN solder climbing, solder balls, high voiding rate, and whitish residues, domestic solder paste can be quickly switched and adapted to improve defects by precisely matching alloy powder types (T3/T4/T5), halogen levels (ROL0 to ROL1), and rosin/water-washable types. SMT solder pastes including LFP-JJY5RQ-0307T4 and LFP-JJY5RR-305 have been batch-verified in automotive lamps, fingerprint locks, and Bluetooth modules, balancing high solder climbing rate with zero-halogen reliability.
Published: 2009-01-07Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.