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Continuous oxidation on the surface of molten solder during wave soldering is the main cause of solder dross formation. High temperatures, air exposure, flux residues, and agitation of the solder bath collectively accelerate the rupture and agglomeration of the oxide film, leading to increased solder dross volume, higher solder consumption, and more frequent equipment maintenance. Field measurements on Jia Jinyuan production lines show that when the increase in solder dross per shift exceeds 1.2kg, solder costs rise by 8.6% year-on-year. Timely oxygen control and solder surface cleaning can reduce solder dross generation by more than 35%.
Published: 2016-09-07Soldering of 01005 components is highly sensitive to solder paste particle size and rheological properties. T6 ultra-fine solder paste (particle size 2~5μm) can significantly reduce the defect rates of solder balls and solder bridges. When its thixotropic index is controlled within the range of 0.75~0.85, it can still maintain clear edges and complete demolding under 0.1mm stencil apertures. Combined with fine-tuning of the printing parameters of Jiajinyuan J-603B solder paste, the measured solder bridge occurrence rate is reduced from 1200ppm to 86ppm.
Published: 2016-06-06Daily routine inspection of reflow soldering production lines is the core line of defense against batch defects. Through systematic checks of rail parallelism, nitrogen purity, deviations between actual and set temperatures in each temperature zone, chain speed stability, and cooling section wind speed every shift, over 90% of typical defects such as cold solder joints, tombstoning, and cold soldering can be intercepted in advance, avoiding batch rework caused by single-point failures.
Published: 2016-03-28
The amount of solder paste is not the more the better; excessive usage will lead to solder beads, bridging, and residual contamination. In actual production lines, poor solder wetting often stems from excessive solder paste printing thickness or mismatched stencil aperture design, rather than simply increasing the amount. Precise control of the solder paste volume ratio and activity matching is the core to ensuring the reliability of solder wetting.
Published: 2016-02-13BGA chip reballing repair relies on precise reballing processes. Jiajinyuan's dedicated solder paste works in synergy with matching solder balls to ensure solder joint coplanarity, tensile strength, and void rate meet standards. This solution has been verified on multiple production lines to stably pass 500 cycles of -40℃~125℃ thermal shock without defects such as solder bridging, cold solder joints, or ball misalignment.
Published: 2016-01-29Excessively high peak reflow temperature of solder paste will directly lead to excessive growth of intermetallic compounds in solder paste joints, intensified dissolution of pad copper, and thermal damage to component bodies. In actual production lines, common defects include cold solder joints, solder balls, tombstoning, and PCB delamination. This problem mostly stems from inaccurate temperature profile settings, drift of furnace temperature sensors, or uncalibrated differences in activity between different batches of solder paste.
Published: 2015-12-10
The acid value of solder paste directly affects solder wettability and residual corrosion risk. Acidic solder paste is suitable for difficult-to-solder metals but requires strict control of the cleaning process, while neutral solder paste is mostly used for high-reliability PCBs and no-clean scenarios. Selection must be comprehensively determined based on the oxidation degree of the substrate, the material of component pins, the reflow temperature window, and the production line's cleaning capability.
Published: 2015-11-01
Prolonged high-temperature operation of solder bars in a wave soldering furnace can indeed cause micro-segregation of alloy components. Particularly when tin-lead or lead-free solder bars are continuously exposed to temperatures above 260°C with insufficient bath surface agitation, elements such as lead, silver, and copper may locally enrich due to differences in density and oxidation rate. However, within the standard 8-hour solder replacement cycle, compositional variations remain well below the tolerances permitted by IPC-J-STD-006. What truly affects soldering stability is often the accumulation of dross and carbonized flux residues.
Published: 2015-10-14High-frequency board welding imposes extremely high requirements on the thermal sensitivity of the substrate. Materials such as PTFE and ceramic-filled PP generally have a glass transition temperature below 170°C. If the peak reflow temperature exceeds 260°C, it can easily cause delamination, blistering, or dielectric constant drift. Actual measurements on Jiajinyuan's production line show that 255°C is the safe threshold for most high-frequency board welding. Thermal damage must be avoided through stepwise heating, reducing residence time in the high-temperature zone, and nitrogen atmosphere control.
Published: 2015-10-08The no-clean and water-washable formulations for PCBA soldering materials need to balance ionic residue control and post-soldering surface cleanliness. The Jiajinyuan series formulations achieve stable performance with rosin-based residue <0.5μg/cm2 and halogen content <0.1wt% in actual production lines, meeting the process requirements for high-density PCBA soldering materials for 01005 components and 0.3mm pitch BGA.
Published: 2015-09-05Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.