SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Soldering Material, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Selective wave soldering significantly reduces changeover time and fixture debugging frequency by precisely positioning soldering areas and skipping already surface-mounted components. In multi-variety, small-batch PCBA production, it compresses the preparation cycle per batch to within 15 minutes, greatly improving overall equipment effectiveness, and serves as the core process support for Jiajinyuan models to achieve high output in small and medium batch order scenarios.
Published: 2017-12-09
Although flux paste and solder paste both contain flux components, they are fundamentally different. Flux paste contains no metal powder and is specifically used for local touch-up soldering or BGA rework, while solder paste is made by mixing tin powder with flux paste and is suitable for SMT fully automatic printing and placement. The two have non-interchangeable process differences in viscosity, metal content, reflow characteristics and equipment compatibility.
Published: 2017-10-04The scientific combination of soldering auxiliary materials with solder paste and solder wire can significantly improve the first-pass yield of soldering. Especially in difficult processes such as 0201 component placement, QFN bottom pad filling, and OSP board surface wetting, Jiayuanjin solder paste paired with soldering auxiliary materials of corresponding activity levels can reduce the probability of cold soldering, solder bridging, and tombstoning, while reducing cleaning residue and ion contamination risks.
Published: 2017-09-21In the entire chip soldering process, the precision of solder paste printing via SMT stencil directly determines the yield of subsequent component placement and reflow soldering. The viscosity, particle size, and metal content of the solder paste, as well as printing parameters such as squeegee pressure, speed, and release distance, must be coordinated and matched with the actual conditions of the production line. Any mismatch will cause typical defects such as insufficient solder, solder bridging, and misalignment.
Published: 2017-09-07
Yellowing and deterioration of solder paste is a common yet easily misjudged issue on SMT production lines, and its essence is mostly related to rosin oxidation, solvent volatilization, or metal ion-catalyzed reactions. Improper storage of solder paste will accelerate this process. Yellowing does not necessarily mean complete failure, but whether to continue using it requires comprehensive judgment by combining measured indicators such as viscosity changes, solder ball residue, and wetting force attenuation.
Published: 2017-08-22During the soldering process of OSP boards, pad oxidation is the main cause of cold solder joints and poor wetting. Reasonably setting the reflow profile can effectively suppress copper surface oxidation, with the key being to control the heating rate, shorten the high-temperature exposure time, and ensure the peak temperature accurately falls within the 195℃~210℃ range. Production line verification by Jiajinyuan shows that when the TAL time exceeds 60 seconds or the peak temperature exceeds 212℃, the decomposition of the OSP film accelerates, and the risk of pad oxidation increases sharply.
Published: 2017-08-04Solder manufacturers provide free sample mailing services to help SMT engineers verify the soldering yield of solder paste, solder wire, or lead-free solder bars in the actual production line environment, avoiding typical defects such as cold solder joints, poor wetting, and solder ball splashing after batch introduction. Jia Jinyuan, a solder manufacturer with 20 years of focus on SMT process supporting, provides samples of all series specifications to match mainstream stencil apertures and reflow soldering profiles.
Published: 2017-07-17Solder paste must balance low spatter, fast melting, strong wetting, and high residue stability in both laser soldering and Hotbar thermocompression soldering. Hotbar solder paste must maintain sharp, non-sagging edges after ultra-thin 0.15mm printing, while laser soldering paste must complete melting within 300ms at a power density of 1200W/cm2 without oxidation black spots.
Published: 2017-07-04Solder dross is continuously generated during wave soldering machine operation and floats on the surface of the molten solder bath. If not removed in time, it will cause intensified liquid level fluctuations, increased risk of nozzle clogging, and frequent solder spikes and bridging on solder joints. Regular dross removal is a key action to ensure consistent wave height and soldering yield. Production line verification by Jiajinyuan shows that manual dross removal every 4 hours can stably control the thickness of solder dross within 3mm.
Published: 2017-06-15
Whether to choose solder wire or solder ribbon for manual welding is essentially a process matching issue. Solder wire is suitable for welding large solder joints and high-heat components, while solder ribbon, with its thinner flux core and more controllable solder output, is adapted for tiny surface-mount components such as 0402 and 0603. The selection of wire diameter must be comprehensively determined by considering the soldering iron power, pad size, and the operator's proficiency level.
Published: 2017-06-11Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.