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Here you can find knowledge about Soldering Material, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Selective wave soldering performs dip soldering on local pins of the PCB through precise positioning, avoiding the thermal shock and bridging risks caused by passing the entire board through the wave. It is suitable for complex single boards with mixed high-density mounting, sensitive components, or bottom shielding covers. In actual tests with Jiajinyuan equipment, the defect rate can be reduced from 1.2% to 0.35%, greatly reducing rework labor and solder dross loss.
Published: 2019-06-28When soldering thick copper PCBs and multilayer boards with BGA, the significantly increased thermal capacity means conventional heating parameters can easily cause cold solder joints or chip warpage. It is necessary to specifically extend the preheating time, increase the temperature of the soaking zone, and slow down the peak heating slope to ensure synchronous melting of solder balls and overall thermal balance of the PCB.
Published: 2019-04-12
In solder wire soldering, solder bridges causing short circuits are mostly caused by excessively small pad spacing, mismatch between solder wire diameter and soldering iron temperature, insufficient flux activity, or uncleared residual oxide layers. In actual production lines, 80% of solder bridge problems stem from the imbalance between operating technique and material adaptability, rather than simple deviations in process parameters.
Published: 2019-02-15When manually soldering mobile phone motherboards, thin-diameter solder wire can precisely cover pads below 0.3mm, avoiding bridging and cold solder joints. Combined with a constant-temperature soldering iron and a high-magnification microscope, it enables reliable connections of tiny solder joints such as peripheral resistors and capacitors around BGA and cable interfaces, making it an indispensable practical process for rework production lines to handle high-density PCBs.
Published: 2018-12-1101005 component soldering is currently one of the most challenging process bottlenecks on SMT production lines. Its 0.4mm×0.2mm size, 0.12mm pad pitch, and extremely low heat capacity require solder paste printing accuracy of ±15μm, placement repeatability ≤±10μm, and reflow peak temperature fluctuation controlled within ±2℃. The measured yield of Jiajinyuan JTY-806 solder paste paired with JTS-300 placement machine is stable at 99.2%～99.5%, but at least 3 rounds of fine-tuning are still required for the first article after line changeover to meet the standards.
Published: 2018-11-19During soldering of ENIG boards, the wettability of solder paste directly affects the formation quality of solder joints. Jiajinyuan solder paste demonstrates excellent spreading ability and low void rate on ENIG boards. With a conventional reflow profile, it can achieve full solder joints, complete pin wrapping, and eliminate common production line defects such as solder spikes and cold solder joints.
Published: 2018-09-28Due to the large heat capacity and slow heating rate of thick copper plate welding, wave soldering is prone to missing solder. Selecting high-wettability solder bars can significantly improve the spreading ability of molten solder on thick copper substrates. Combined with the collaborative optimization of process parameters such as increasing the preheating temperature to 130℃～140℃ and reducing the chain speed to 1.0m/min～1.2m/min, it effectively solves problems such as insufficient solder joints, bridging defects, and cold solder on the back of the PCB.
Published: 2018-08-29
The solder paste can be directly applied to PCB pads, but this is limited to special scenarios such as rework, small-batch manual soldering, or BGA ball mounting. Direct application is strictly prohibited on conventional SMT placement production lines, otherwise it will cause problems such as solder paste printing misalignment, increased void rate after reflow, and corrosion of pads by residues. A comprehensive judgment must be made based on the specific process window, activity level of the solder paste, and surface treatment method of the PCB pads.
Published: 2018-08-11
What solder paste to use for BGA repair and how to select the appropriate activity level directly affects the first-pass rework success rate and solder joint reliability. Production line verification by JJY shows that medium-activity RMA solder paste balances wettability and controllable residue in most BGA soldering scenarios; high-activity RA solder paste is only suitable for special chips with severe oxidation or poor plating, while no-clean solder paste must be paired with nitrogen-protected reflow conditions.
Published: 2018-06-29The process window setting for lead-free solder paste reflow soldering must balance the coordinated control of peak temperature and soaking zone. Jia Jinyuan lead-free solder paste performs stably in the peak temperature range of 235°C to 245°C. However, if the soaking zone temperature is below 150°C and the duration is less than 60 seconds, it can easily lead to poor wetting and increased void rate. In actual production lines, the conveyor speed and the power of each temperature zone need to be dynamically adjusted based on the measured curves from a temperature profiler.
Published: 2018-06-18Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.