SMT Solder Paste Manufacturers.
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Here you can find knowledge about Soldering Material, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
PCBA soldering materials cover a full range of auxiliary materials including solder paste, solder wire, flux, cleaning agent and nitrogen. Their selection and control directly determine the SMT placement first-pass yield and long-term reliability. The Jiajinyuan series performs stably under stringent parameters such as reflow soldering peak temperature of 235℃±5℃, solder paste viscosity of 700±100Pa·s, and flux solid content of 18.5%.
Published: 2021-04-07When reflow soldering precision BGA/QFN devices, the heating rate directly affects solder joint void ratio, solder ball collapse consistency, and PCB warpage risk. In particular, a preheat ramp exceeding 3℃/s can easily cause ceramic substrate cracking, while insufficient flux residue control occurs when the soak stage duration below 150℃ is less than 90 seconds. Jia Jinyuan's measured data shows that the void ratio of QFN bottom solder joints increases by 27% as the heating slope rises by 1.2℃/s. The temperature difference across the entire board must be controlled within ±2.5℃ to ensure first-pass yield.
Published: 2021-03-25
The division of application scenarios between solder paste and liquid flux depends on solder joint size, component density, and equipment compatibility. Solder paste is suitable for stencil printing or dispensing processes for 0201 and smaller micro components, while liquid flux is mostly used for through-hole insertion, rework on large solder pads, and pre-spraying before selective wave soldering. The two are often used in combination in SMT production lines according to process cycle time and residue control requirements.
Published: 2021-03-09When soldering 5G devices on high-frequency PCBs, solder faces the practical issue of increased void rate that exacerbates signal attenuation. By optimizing metal content, rheological properties, and flux volatilization pathways, low-void solder paste has been verified on actual production lines of the Jiajinyuan JH-5G series, stably controlling the void rate of BGA solder joints within 8%, significantly improving the impedance continuity and return loss performance of RF modules in the millimeter-wave frequency band.
Published: 2021-01-19When soldering BGA devices on thick copper boards, due to the large heat capacity and slow heating rate, the flux in the solder paste does not volatilize sufficiently and gas escape is hindered, making it extremely easy to form void defects inside solder joints. It is necessary to select a special solder paste with low residue, high activity, and a wide reflow window; otherwise, the void rate generally exceeds 25%, far exceeding the requirement of ≤15% for IPC-A-610 Class G.
Published: 2020-12-08Selective wave soldering bar selection must balance melting point stability, surface tension, and oxide film formation rate; solder dross control is directly affected by solder bar purity, copper and iron impurity content, and flux compatibility. The Jiajinyuan SN99.3CU0.7 series has a measured dross rate below 1.2% in small and medium batch high-density board soldering, significantly outperforming conventional solder bars.
Published: 2020-11-14
When choosing between syringe-packaged and bottled solder paste for mobile phone repair, the key factors are work precision, reapplication frequency, and solder ball control capability. Syringe packaging delivers stable paste output in high-precision electronic repair scenarios such as BGA ball mounting and flying wire soldering, and is less likely to contaminate PCBs. Bottled solder paste, while lower in cost, is prone to oxidation and introduces more impurities during dipping, which in turn increases the rate of cold solder joints and rework over long-term use.
Published: 2020-11-10In actual production lines, solder auxiliary materials must be flexibly selected between no-clean or water-washing processes according to the reliability requirements of end products. The Jiajinyuan series of solder auxiliary materials achieve adaptation to the dual demands of fast-paced consumer electronics production and high cleanliness standards for automotive electronics without equipment replacement by adjusting rosin content, activator ratio, and solvent boiling point distribution.
Published: 2020-10-18BGA soldering in 5G communication and energy storage motherboards faces challenges of high thermal stress, long-term aging, and high-frequency signal integrity. By optimizing stencil aperture design, segmented temperature control of reflow profile, and post-soldering full X-ray inspection process, JJY ensures that BGA solder joints have no void expansion and no abnormal IMC thickening after 1000 hours of accelerated aging at 85℃/85%RH, achieving true long-term reliability.
Published: 2020-08-15In fine-pitch IC reflow soldering, the metal content, particle size distribution and flux activity of solder paste must match pad pitches below 0.4mm. Yield fluctuations exceeding 30% in reflow soldering often stem from uneven solder paste collapse or insufficient wetting after reflow. For Jiajinyuan JH-812A, the measured bridging rate on 0.35mm pitch QFN is below 0.12%. Its 25μm median particle size and 55% metal content work synergistically to suppress printing misalignment and reflow splattering.
Published: 2020-06-11Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.