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Excessive wave soldering dross directly affects soldering yield and the consumption cost of solder bars. Common causes include high impurity content in solder bars, uncontrolled wave soldering temperature, severe carbonized flux residue, excessive stirring of the solder pot, and insufficient nitrogen protection. Solutions require coordinated efforts across multiple dimensions, including solder bar selection, temperature profile optimization, regular dross removal frequency, flux volatilization control, and nitrogen purity monitoring.
Published: 2021-10-21During the pin dip soldering process, by precisely controlling the dip soldering time, temperature and flux activity, the pin dip tin thickness can be effectively controlled between 0.03mm and 0.08mm, avoiding pin adhesion and bridging defects caused by an excessively thick tin layer. Measured data from the Jiajinyuan production line shows that after reducing the dip soldering time from 5 seconds to 3.2 seconds, the bridging rate decreased by 67%. This method has been batch-verified in the pre-treatment stage of DIP plug-in wave soldering.
Published: 2021-10-20Poor wetting of the bottom pad during QFN soldering often leads to cold solder joints or voids. By changing the stencil aperture from the conventional 1:1 to a 0.92:1 trapezoidal scaling design, JJY significantly improves the solder paste transfer rate without increasing the amount of solder. Combined with the coordinated control of squeegee pressure at 0.45 MPa and speed at 45 mm/s, the wetting area of the QFN soldering bottom pad is increased from 68% to 91%, and the measured solder joint void rate is below 12%.
Published: 2021-09-26To address the issue of warpage that easily occurs in thin PCB boards during solder paste soldering, this paper starts from the rheological properties, metal content, thixotropic index of solder paste and the volatilization behavior of flux, proposes a selection and process coordination scheme adapted to thin board solder paste, and emphasizes the practical effects of low-stress solder paste, medium-low temperature reflow window and fine-tuning of printing parameters on suppressing warpage.
Published: 2021-09-06Connector solder is specifically designed for welding various electronic connector terminals, featuring excellent wettability, low void rate, and strong thermal shock resistance. It is suitable for high-density connection scenarios such as FPC, board-to-board, and wire-to-board, and exhibits stable thrust and low cold solder joint rate in both reflow soldering and selective wave soldering processes, making it a critical solder material for ensuring the long-term insertion and removal reliability and signal integrity of connectors.
Published: 2021-08-28
The large amount of smoke generated by solder wire during welding mainly comes from thermal decomposition of flux, excessively high welding temperature, excessively high rosin content in the solder wire, or poor ventilation. These factors jointly increase the generation intensity and toxicity risk of welding fumes, which is particularly prominent in wave soldering and manual soldering iron operations.
Published: 2021-08-03The control of the dwell time of the OSP board welding production line is directly related to the chemical stability and solderability of the OSP film layer. If the exposure time of the PCB from the spray OSP treatment to before reflow soldering exceeds 48 hours, or if it stays in a high-temperature and high-humidity environment (such as RH > 60%, T > 25°C) for more than 24 hours, the film layer is prone to hydrolysis and oxidation, which will cause the solder joint void rate to increase by more than 12% and the wetting angle to increase to more than 45°. Actual measurements on the Jiajinyuan production line show that this problem accounts for 67% of the solder bridging defects in OSP board welding.
Published: 2021-07-09When manually soldering and repairing old PCBs, oxidized solder pads cause poor tinning and frequent cold solder joints. High-activity solder wire significantly improves the first-pass soldering success rate through stronger oxide film penetration and lower wetting temperature, and is especially suitable for manual soldering rework scenarios of communication boards and industrial control motherboards in service for over 8 years.
Published: 2021-06-22Jiajinyuan has passed the ISO factory audit for solder materials and can provide authentic and valid ISO system certificates, covering production process control of the full range of products including solder paste, solder wire, and flux, ensuring that each batch of ISO solder materials meets the requirements of standards such as IPC-J-STD-005 and JIS Z3197, and satisfying the second-party audit needs of automotive electronics and medical equipment customers.
Published: 2021-05-24In multilayer PCB stack soldering, solder paste selection directly affects solder joint reliability and yield. It is necessary to comprehensively consider the melting point gradient, thixotropy matching, and flux residue characteristics of the stacked solder pastes. Especially when 0.3mm pitch BGA and fine-pitch QFN coexist, a dual-temperature-zone compatible solder paste must be selected, with the reflow peak temperature of the main solder paste at least 25°C higher than that of the underlying stacked solder paste, to avoid cold solder joints or solder balls caused by secondary reflow.
Published: 2021-04-30Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.