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Soldering on ENIG boards imposes extremely stringent requirements on the halogen residue, wettability, and residue insulation of solder paste. Halogen-free solder paste stands out in preventing excessive dissolution of the gold layer, reducing leakage current during ICT testing, and improving long-term reliability. Jiajinyuan's halogen-free solder paste has been validated on multiple high-end HDI board production lines, demonstrating stable printability under 0.3mm pitch QFN and 0.4mm BGA packages, along with an actual void rate of <8%.
Published: 2023-07-11During dip soldering, temperature runaway in manual dip soldering pots is the main cause of cold solder joints and missed solder joints. For the JiajinYuan manual dip soldering pot, the solder bath temperature must be stably controlled at 255℃±3℃, the preheating zone maintained at 90℃~110℃, and the dip soldering time strictly limited to 3 seconds±0.5 seconds. Imbalance in the coordination of these three factors will cause bridging or poor wetting.
Published: 2023-06-14To address the frequently occurring issues of solder paste tombstoning, cold solder joints, and poor wetting on OSP gold-plated pads in SMT production lines, and drawing on 20 years of on-site commissioning experience, this paper provides immediately actionable countermeasures from four aspects: solder paste selection compatibility, stencil aperture design redundancy, reflow profile activity window control, and collaborative management of PCB pad surface conditions, directly targeting the root causes of uneven solder paste wetting and cold solder joint defects.
Published: 2023-05-12Solder dross is continuously generated during continuous wave soldering, and its production volume is directly affected by solder pot temperature, conveyor speed, flux activity, and PCB design. Production line data from Jia Jinyuan shows that every 0.5 kg/h increase in dross increment raises the material cost per board by 0.32 yuan. Therefore, dross volume control is not an auxiliary step, but the true cost control center of the wave soldering process.
Published: 2023-05-03Circuit board soldering faces multiple challenges of high reliability, fine pitch, and heat-sensitive components in the medical, communication, and new energy sectors. Based on practical production line experience, this paper focuses on key processes such as solder paste selection, stencil aperture design, reflow profile optimization, and BGA rework, emphasizing solder joint wettability, void rate control, and cold solder joint identification methods. All parameters are derived from measured data from Jia Jinyuan production lines, without theoretical deduction.
Published: 2023-01-22QFN soldering on new energy electronic control boards faces dual challenges of high-frequency vibration and thermal cycling. By optimizing stencil aperture design, reflow profile, and pad design, Jiajinyuan has increased the thrust of QFN solder joints to over 28N, with the IMC layer thickness controlled at 3.2μm±0.4μm, effectively suppressing microcrack propagation and meeting the long-term reliability requirements of automotive-grade IPX7 protection and operating conditions ranging from -40℃ to 125℃.
Published: 2022-12-11
The temperature control range of solder bars in wave soldering machines is typically 250°C to 265°C, which should be comprehensively adjusted based on the alloy composition of the solder bar, PCB thickness, component density, and flux activity. Excessively high wave soldering temperatures can easily cause copper foil peeling and thermal damage to components, while excessively low temperatures can lead to cold solder joints, solder spikes, and bridging. In actual production lines, dynamic fine-tuning must be performed by combining solder fluidity tests and solder joint cross-section analysis.
Published: 2022-11-29For soldering gold-plated boards, it is necessary to balance the thickness of the pad gold layer with the activity matching of the flux to avoid black pad, cold solder joints, and excessive IMC growth. Jia Jinyuan's gold-plated board soldering solution has achieved a soldering defect rate below 0.3% in aerospace modules and medical equipment, with the key lying in the collaborative implementation of solder paste selection, reflow profile gradient control, and an oxygen content ≤100ppm under a nitrogen atmosphere.
Published: 2022-11-255G device solder must meet the dual stringent requirements of high-frequency signal integrity and thermal cycle reliability. Jinyuan JNY-5G188 lead-free solder achieves zero void rate soldering in scenarios such as base station power amplifier modules and router RF motherboards. Its low-silver ratio and active flux synergistically optimize wetting speed and residue insulation.
Published: 2022-11-11Conduct actual measurements on small-batch samples of sensor soldering solder to verify its wetting and spreading performance and void rate control capability under the conditions of 0.3mm pitch micro-pads and gold-plated nickel-palladium-gold surface treatment, with a focus on examining the bridging suppression effect and IMC layer uniformity of Jiajinyuan JH-851A lead-free solder at a peak temperature of 235℃ under a nitrogen atmosphere.
Published: 2022-10-29Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.