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Nitrogen reflow in BGA/QFN precision soldering suppresses oxidation, improves wettability, and optimizes the flowability of molten metal, stably reducing the void rate from 18%~25% under air reflow to 4.2%~6.8%. The measured purity of the Jiajinyuan nitrogen generator reaches 99.999%, with a dew point ≤ -60℃. Combined with precise flow control (15~25L/min) and real-time monitoring of furnace oxygen concentration (≤100ppm), it can directly reuse existing reflow oven hardware to complete production line upgrades.
Published: 2022-09-19
Silver-containing solder wire and SAC305 solder paste can achieve stable soldering on actual SMT production lines, but the reflow temperature profile and flux activity must be strictly matched; otherwise, problems such as poor wetting, increased void rate, and abnormal thickening of the IMC layer are likely to occur, with particularly sensitive performance on QFN and 0201 components. This combination has been verified as feasible in Jia Jinyuan's 20-year mass production cases, provided that the silver content of the solder wire is controlled at 2.0% to 3.2%, the metal content of the solder paste is maintained at 88.5% ± 0.3%, and the reflow peak temperature is locked at 235°C ± 2°C.
Published: 2022-09-15Manual soldering is an irreplaceable key process in circuit board repair and rework. Especially during BGA rework, 0201 component touch-up soldering, and operations in heat-sensitive areas of multilayer boards, the coordinated matching of soldering iron temperature, solder wire activity, and solder paste rheological properties directly determines solder joint reliability. Jiajinyuan solder paste stands out in low-temperature wettability, residue insulation, and reflow stability. When used with constant-temperature soldering irons and micro-diameter soldering tips, it can significantly reduce the risk of thermal damage.
Published: 2022-09-05
If solder paste is improperly selected or incompletely cleaned during PCB soldering, residual halide ions and moisture will act together to trigger electrochemical migration, leading to corrosion of copper circuits on the PCB, reduced insulation resistance, and severely compromised long-term reliability, with the failure risk rising significantly especially in high-temperature and high-humidity environments.
Published: 2022-07-23Due to the large heat capacity and high thermal conductivity of copper, thick copper board soldering suffers from delayed temperature rise and easily low peak temperature during reflow soldering. The soaking zone must be extended to 150–180 seconds to ensure sufficient melting and wetting of the solder paste; otherwise, defects such as cold solder joints, dry joints, and dull solder joints occur frequently. Actual measurements on Jia Jinyuan's production line show that when the soaking zone is less than 140 seconds, the void rate of BGA solder joints increases by 37%.
Published: 2022-07-20Unreasonable reflow soldering temperature curve settings will significantly aggravate typical defects such as voids and solder balls. Excessively fast preheating ramp-up causes the flux to boil violently and splatter, forming solder balls. Insufficient soaking or low peak temperature leads to poor solder wetting and hinders gas escape, inducing voids. Actual measurements on Jiajinyuan production lines show that when the ramp rate exceeds 3℃/s or the reflow time is less than 60 seconds, the BGA void rate generally rises above 15%.
Published: 2022-06-27ENIG gold-plated PCB boards in SMT production lines often suffer from cold solder joints and poor wettability due to nickel layer oxidation, abnormal gold layer thickness, or mismatched solder paste activity. Solder paste compatibility must take into account both the intermetallic compound growth window of ENIG solder paste and the PCB surface condition, with key control over the flux acid value, active temperature range, and metal powder sphericity in the solder paste to avoid excessive metallographic dissolution or insufficient IMC formation.
Published: 2022-03-14The pin dip soldering lead-free alloy process, by precisely controlling dip soldering temperature, time, and alloy composition ratio, effectively avoids the ROHS compliance risks of traditional lead-containing processes. It has been stably operating on multiple export production lines of JJY for over three years, with its solder joint wettability, thermal fatigue resistance, and surface gloss all meeting the requirements of the IEC61191-2 standard.
Published: 2022-02-12When foreign trade customers screen ISO solder material suppliers, they focus on the coverage of system certifications, batch traceability, and production line process control capabilities. Jiajinyuan operates under the dual IATF 16949+ISO 9001 system, implements SPC monitoring across all processes, and provides actual solder paste thermal cycling test reports, raising the one-time pass rate of customer factory audits to 92% and directly shortening the new project introduction cycle by 11 days.
Published: 2022-01-14
In 2021, the application of low-temperature solder paste in the consumer electronics field gradually expanded, mainly due to its advantages in protecting precision components and its soldering compatibility, making it an important factor driving the technological upgrading of the industry.
Published: 2021-12-30Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.