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To meet the actual production line requirements for solder materials used in industrial control motherboards, this summary focuses on the compatibility issues of solder paste in SMT printing, reflow soldering and wave soldering processes, and elaborates on the synergistic performance of Jiajinyuan solder paste and matching solder bars in high-reliability soldering, covering key process parameters such as viscosity adaptation, metal content control, and residue corrosion inhibition.
Published: 2013-06-25Batch-to-batch color variation of solder paste is a high-frequency cause of production line abnormalities, often reflecting deviations in flux composition or differences in the oxidation level of metal powder, which directly affect the printability, slump behavior, and reflow wetting capability of solder paste, leading to concentrated outbreaks of defects such as cold solder joints, solder bridges, and solder balls. This effect is particularly pronounced in high-density mounting scenarios such as 0201 and 0.4mm pitch QFN.
Published: 2013-06-22Gold-plated board soldering undertakes high-reliability connection tasks in the manufacturing of medical and precision instrument PCBs. Its surface process must balance solderability, corrosion resistance, and long-term signal stability. Gold-plated board soldering is particularly suitable for scenarios requiring micro pads, high-frequency devices, and low contact resistance. Gold layer thickness control, nickel barrier integrity, and reflow parameter matching are key bottlenecks for mass production yield.
Published: 2013-06-11High-frequency board welding is extremely sensitive to solder paste voiding rate. Dielectric parameter fluctuations caused by voids directly degrade signal integrity. Jiajinyuan low-void solder paste, by optimizing metal content, flux volatilization gradient and reflow wetting dynamics, stably controls the voiding rate of BGA solder joints within 3.2% in 5G RF module tests, significantly suppressing insertion loss drift in high frequency bands.
Published: 2013-05-22Sensor soldering solder with low ionic residue can significantly suppress leakage current and interfacial electrochemical migration, avoiding sensing signal drift and zero-point offset. Especially in MEMS and gas sensors with high impedance and microvolt-level output, excessive ionic residue will directly lead to deteriorated signal-to-noise ratio and reduced long-term stability. The Jiajinyuan LIS-702 series solder has a measured Cl?+Br?＜0.05 wt% and Na?+K?＜0.12 wt%, meeting the no-clean grade requirements of IPC J-STD-004B.
Published: 2013-04-29When soldering BGA/QFN chips via SMT, an excessive void rate can lead to cold solder joints, increased thermal resistance, and early failure, and low-void solder paste is the core solution to this problem. The void rate of Jiajinyuan JL-808 series solder paste is stably controlled below 8% in mass production. Combined with optimized stencil aperture design and nitrogen-protected reflow, it can reduce the void rate at the bottom of QFN packages from 25% to 6.3%, while the void rate of individual BGA balls is simultaneously reduced to 4.1%.
Published: 2013-03-25The process parameter debugging of selective wave soldering should focus on the coordinated matching of nozzle temperature, chain speed, tin immersion time, and nitrogen coverage intensity. In actual production lines, Jiajinyuan equipment can significantly suppress bridging defects between pins of QFP-44 and SOIC-28 devices by controlling the nozzle temperature at 255℃±2℃, setting the chain speed at 0.8m/min, maintaining the single-point tin immersion time at 3.2 seconds, and stabilizing the nitrogen flow rate at 12L/min, which is especially suitable for secondary soldering scenarios after rework of high-density double-sided boards.
Published: 2013-01-16
The purity of solder bars directly affects the quality of wave soldering joints. 99.99% purity solder bars can significantly reduce the rate of solder joint voids and poor wetting, while solder bars containing lead or excessive impurities are prone to forming solder balls, sharp protrusions, and bridging defects at the edges of PCB pads. Production line measurements show that for every 0.005% excess in the total amount of impurities such as copper, iron, and arsenic in the solder bars, the rate of cold solder joints increases by 12% to 18%.
Published: 2012-11-17In dip soldering, the oxidation resistance of tin bars directly affects the amount of tin dross generated. By optimizing the tin-copper-nickel ternary alloy ratio and adding trace rare earth elements, Jiajinyuan tin bars reduce the oxide film growth rate by 40% at a conventional dip soldering temperature of 255℃～265℃. The measured tin dross loss per shift drops from 1.8kg to 0.95kg, significantly reducing the frequency of manual dross skimming and the tin bar replenishment interval.
Published: 2012-10-07Poor wetting of oxidized old pads during rework soldering is a high-frequency production line failure. Jia Jinyuan JY-808 high-activity flux can effectively reduce the CuO layer and lower surface tension. Combined with precise temperature-controlled soldering tip operation in a 350°C nitrogen environment, it increases the spread rate of solder paste on oxidized copper pads from less than 40% to over 92%, significantly shortening the rework cycle and reducing missed detection of cold solder joints.
Published: 2012-07-22Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.