SMT Solder Paste Manufacturers.
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Here you can find knowledge about Soldering Auxiliary Materials, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
In welding work, when confronted with the difficulty of excessive smoke, the key points lie in the f
Published: 2026-05-12
ForLow-temperature tin wireDuring the usage process, there are problems such as the soldering iron t
Published: 2026-05-12
If you find that the edges of the solder paste are uneven, there are burrs or stains on the surface
Published: 2026-05-12In the production processLead-free solder pasteWhat problems may occur during reflow soldering opera
Published: 2026-05-12
JJYLead-free solder paste manufacturertheSMTThe reflow soldering specification refers to the tempera
Published: 2026-05-12
Starting from January 1, 2026, multiple leading SMT solder suppliers, in collaboration with production line process teams, have completed a new round of reflow soldering adaptability optimization. By adjusting the metal powder particle size distribution and flux activity gradient, the cold solder joint rate of SMT solder in 0.3mm pitch CSP package soldering has been reduced to 0.08%.
Published: 2026-04-14
Low-temperature solder wire is suitable for soldering heat-sensitive components such as MLCCs, tantalum capacitors, LED beads, CMOS image sensors, and flexible FPCs. Its 138℃ melting point significantly reduces the risk of thermal shock. Combined with the moderately active rosin core and low residue, it balances wettability and component reliability in both SMT reflow and manual touch-up soldering.
Published: 2026-01-08
In 2026, innovation in solder paste materials is accelerating, with new nano-additive technologies being gradually applied in high-end soldering scenarios to improve solder joint reliability. As the electronics manufacturing industry continues to raise its requirements for precision processes, solder paste, as a key material, is undergoing technological innovation, driving the industry toward higher standards.
Published: 2026-01-08As fine-pitch QFN pin spacing shrinks, the risk of bridging is further aggravated. Anti-slump and anti-tailing performance must be achieved by regulating the rheological properties of solder paste. JF-608 solder paste from Jiajinyuan demonstrates excellent viscosity retention under 217°C reflow conditions. When paired with 0.12mm stencil aperture and a 35° squeegee angle, it can stably control the bridging rate within 80ppm.
Published: 2025-11-11The solder used for Jiajinyuan sensor welding adopts a halogen-free formula design, meets the requirements of the IEC 61249-2-21 standard, has an ionic contamination value of post-welding residue lower than 0.5μg/cm² NaCl equivalent, can pass the high-reliability verification of medical sensors without cleaning, and is especially suitable for low-temperature welding scenarios of tiny heat-sensitive components such as platinum resistors and MEMS pressure cores.
Published: 2025-10-14Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.