SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Soldering Auxiliary Materials, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Excessive impurities in solder bars directly cause wave soldering defects, common defects include solder spike, bridging, cold solder joint and PCB surface blackening. Solder bars with copper content >0.3wt%, iron content >0.02wt%, and arsenic content >0.005wt% are highly likely to cause reduced solder fluidity, increased dross, and increased wetting angle at a soldering temperature of 255℃±5℃.
Published: 2026-08-27
Soldering of miniature components imposes stringent requirements on solder paste particle size and rheological properties. Fine-particle solder paste, with its 4-6μm spherical particles, viscosity of 320±30Pa·s at 25±2℃, and compatibility with 120-mesh stencils, significantly improves printing accuracy and solder joint consistency in the mounting of miniature components such as 0201 and 01005.
Published: 2026-08-27
A Practical Soldering Guide for Communication Motherboards for SMT Engineers, focusing on the material selection logic of solder paste and solder bars in high-frequency and high-speed signal scenarios. It covers hard parameters such as storage temperature and humidity, metal content, viscosity, particle size distribution, and reflow peak temperature. Combined with the stringent requirements for solder joint wettability and residual ion contamination of 0.3mm fine-pitch BGA and 10Gbps SerDes routing, it provides the specific application boundaries of IPC-J-STD-005 certified solder paste and Sn96.5Ag3.0Cu0.5 solder bars.
Published: 2026-08-27
When excessive voids occur in SMT soldering, simultaneously investigate the solder paste metal content, flux volatilization curve, and actual temperature deviations in each reflow oven zone. Focus on verifying whether the preheat ramp exceeds 2°C/s, whether the peak temperature is below 235°C or above 245°C, and whether the time above liquidus is less than 60 seconds or exceeds 90 seconds.
Published: 2026-08-27
The LFP-5RTS series halogen-free and lead-free high-temperature solder paste is suitable for high-temperature reflow soldering processes, and delivers excellent soldering stability and environmental performance.
Published: 2026-08-24
Jiajinyuan LFP-5RQ series halogen-free and lead-free high-temperature solder paste adopts a low-halogen formula, with transparent soldering residues, helping electronic manufacturing enterprises meet the environmental control requirements of RoHS and REACH.
Published: 2026-08-24After reflow soldering, solder bead defects appear, which are closely related to the performance and usage of the solder paste. This paper explores the key role of solder paste in the soldering process through practical case analysis.
Published: 2026-08-24Improper solder paste stirring can easily lead to cold soldering risks and affect soldering quality. Correct solder paste stirring operations can reduce the defect rate and ensure stable production.
Published: 2026-08-24
LFP-5RW5 series lead-free solder paste is specifically designed for welding stainless steel and aluminum, effectively solving the wetting challenges in dissimilar metal welding.
Published: 2026-08-24Moisture absorption of solder paste can lead to defects such as bubbles and voids during reflow soldering, affecting solder quality. Proper storage and use of solder paste are critical.
Published: 2026-08-24Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.