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Application of LFP-5RTS Series Halogen-Free and Lead-Free High-Temperature Solder Paste in High-Temperature Reflow Soldering

The LFP-5RTS series is a halogen-free and lead-free Solder Paste product developed by JiajinYuan for high-temperature Reflow Soldering processes. It offers two powder particle size specifications, LFP-5RTS-305 and LFP-5RTS-0307, which are respectively suitable for different pad densities and component types.

This series of solder paste adopts a composite Flux system of synthetic resin and modified rosin. It can maintain good activation performance in the high-temperature reflow zone above 220°C, effectively remove the oxide layer on the surface of pads and component terminals, and ensure good wetting and spreading of the molten alloy.

During the soldering process, the LFP-5RTS series demonstrates a wide process window. Stable solder joint morphology can be achieved when the peak temperature of the reflow profile ranges from 235°C to 250°C. The flux residue is minimal and light in color, which does not affect the recognition accuracy of subsequent AOI visual inspection.

Practical production line applications show that this series of products performs excellently in the soldering of multi-layer PCB thick copper circuit boards. The problems of solder joint icicles and cold soldering are significantly improved, making it suitable for mass production of high-reliability electronic products such as communication equipment and industrial control systems.

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