JJY's newly launched LFP-5RQ series halogen-free and lead-free high-temperature Solder Paste is developed specifically for high-reliability electronic assembly scenarios. This series includes two models, LFP-5RQ-305 and LFP-5RQ-0307, corresponding to 305-type and 0307-type powder particle size specifications respectively, which can meet the different soldering needs of fine-pitch components and conventional power devices.

The product adopts a low-halogen formulation design, with the halogen content strictly controlled within the threshold required by the RoHS directive. The Flux residue after Reflow Soldering is transparent, and can pass electrical performance testing without additional cleaning, making it suitable for application scenarios with stringent cleanliness requirements such as medical electronics and automotive electronics.

In terms of process performance, the LFP-5RQ series solder paste has excellent thixotropy and anti-slump properties, and can maintain stable release quality even after 8 hours of continuous stencil printing operation. The solder joints are bright and full, with uniform wetting and spreading, which can effectively suppress bridging and solder ball defects between fine-pitch pads.

Combined with the measured data from customer production lines, the LFP-5RQ series exhibits stable soldering performance under both nitrogen reflow soldering and air reflow soldering process conditions, with a soldering yield rate maintained above 99.5%. It is an optimal solution for replacing imported mid-to-high-end halogen-free solder pastes.