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Void-free nitrogen reflow combined with low-void solder paste can reduce the void ratio of BGA solder joints from 15% to below 3%. This combination has been stably running on Jia Jinyuan's production line for over 2 million units. The key is that nitrogen purity must be maintained above 99.995% with oxygen content below 50 ppm. Combined with the thixotropy optimization and activator gradient volatilization design of Jia Jinyuan LDS-702 low-void solder paste, voids are effectively suppressed in the early stage of reflow.
Published: 2025-05-26Nitrogen reflow significantly suppresses the oxidation reaction between metal powder and flux in solder paste during the high-temperature phase by reducing the oxygen concentration in the furnace to below 100 ppm, thereby improving the wetting ability of solder on PCB pads and component pins. It is particularly effective in addressing poor wetting issues on OSP surface-finished boards and fine-pitch QFN packages, and is a process optimization method validated as effective on JJY's production line.
Published: 2024-12-11
The occurrence of solder balling during the reflow soldering process is not necessarily a quality issue with the solder paste itself; it is more often related to the coupling of multiple factors such as printing parameters, stencil design, temperature zone settings, and ambient humidity. Especially when the solder paste is unevenly heated during the reflow stage or the solvent volatilizes insufficiently, splashing-type solder balls are highly likely to be induced. Therefore, troubleshooting should start from the storage conditions of the solder paste, the matching of the reflow soldering profile, and the coordination of the PCB pad layout.
Published: 2024-12-02Tin whisker growth after solder paste reflow is a critical failure mode affecting solder paste reliability. Its root causes are closely related to the silver content, grain size, flux residue, and intermetallic compound growth kinetics in the solder paste formulation. By precisely regulating the Sn/Ag/Cu ratio in the solder paste formulation, adding trace inhibitory elements, and optimizing the thermal stability of the flux, the whisker initiation time can be significantly delayed.
Published: 2024-06-30Cold soldering is the most hidden fatal defect in SMT production lines. Insufficient reflow peak temperature prevents the solder paste from fully melting and wetting the pads, resulting in cold solder joints and false soldering. Jia Jinyuan solder paste can only complete the eutectic reaction above 183°C, and its wetting force drops sharply when the temperature is below 205°C. Cold solder joints have a gray surface without metallic luster, and the thrust test value is more than 50% lower than the standard value.
Published: 2024-06-15In formic acid atmosphere vacuum reflow soldering, solder paste must balance activity control and bubble removal; vacuum solder paste must have low vapor pressure, high thermal stability, and formic acid compatibility, while formic acid reflow solder paste requires a flux system that can synergistically reduce oxides with formic acid without exacerbating metal corrosion. These three factors jointly determine the void fraction and shear strength of solder joints in high-power devices.
Published: 2024-04-21Bridging is one of the defects most likely to cause batch short circuits in the SMT process, and pre-reflow AOI inspection can intercept bridging risks before soldering, avoiding a sharp increase in rework difficulty caused by high-temperature curing. Jiajinyuan AOI equipment, through high-resolution imaging and dynamic threshold algorithms, accurately identifies micron-level bridging trends after solder paste printing and after component placement is completed but before entering the reflow oven.
Published: 2024-02-04Debugging the BGA soldering reflow curve requires precise matching of the solder paste activity window and solder ball melting characteristics. By optimizing the preheating slope, extending the soaking time, and controlling the peak temperature plateau width, the void rate can be significantly reduced. Test data from JJY shows that the void area ratio was reduced from 18.7% to below 6.2%.
Published: 2023-10-22The vacuum reflow process for solder paste imposes higher requirements on the metal content, flux activity, residue insulation, and high-temperature stability of the solder paste. Vacuum solder paste must feature low volatile content, high wetting power, and anti-slump properties; otherwise, it can easily cause persistent production-line issues such as excessive void rate, cold solder joints, or solder ball splashing. The reliability of solder paste soldering is directly constrained by the suitability of its selection and matching.
Published: 2023-10-05The setting of the constant-temperature segment during the liquid phase time in the solder paste reflow profile directly affects the wettability and void rate of solder joints. In actual production lines, adjustments must be made comprehensively based on the solder paste manufacturer's recommended values, PCB heat capacity distribution, and oven temperature stability. The typical liquid phase time should be controlled between 60 and 90 seconds: too short a time can easily lead to cold solder joints, while too long a time will accelerate the growth of intermetallic compounds and cause component tombstoning or pad peeling.
Published: 2023-03-25Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.