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The LFP-5RTS series halogen-free and lead-free high-temperature solder paste is suitable for high-temperature reflow soldering processes, and delivers excellent soldering stability and environmental performance.
Published: 2026-08-24This article directly addresses the practical pain point of tombstone defects caused by poor reflow profile matching during solder paste selection. Based on five sets of real production line failure data, it restores phenomena item by item, locates root causes, and provides immediately executable debugging steps and verification methods. All solutions have been verified in mass production, focusing on the coupling relationship between solder paste activity, melting point distribution, wetting rate and furnace temperature window.
Published: 2026-08-24After reflow soldering, solder bead defects appear, which are closely related to the performance and usage of the solder paste. This paper explores the key role of solder paste in the soldering process through practical case analysis.
Published: 2026-08-24After reflow soldering, solder joints turn black, which is mainly related to flux residues in the solder paste. By controlling solder paste usage, optimizing reflow soldering parameters, and strengthening the cleaning process, residue problems can be effectively reduced and soldering quality can be improved.
Published: 2026-08-24Moisture absorption of solder paste can lead to defects such as bubbles and voids during reflow soldering, affecting solder quality. Proper storage and use of solder paste are critical.
Published: 2026-08-24
Wave soldering is mainly used for making soldering software, while reflow soldering is used for maki
Published: 2026-05-12
AlthoughSolder pasteWhat the users have learnedSolder paste manufacturerNot many, but when it comes
Published: 2026-05-12In the production processLead-free solder pasteWhat problems may occur during reflow soldering opera
Published: 2026-05-12
JJYLead-free solder paste manufacturertheSMTThe reflow soldering specification refers to the tempera
Published: 2026-05-12Reflow soldering is a key step in the SMT placement process to achieve metallurgical bonding of component pads. Solder paste goes through four stages in the reflow oven: preheating, soaking, reflow, and cooling, to complete melting and wetting. Its temperature profile setting, furnace temperature uniformity, and solder paste activity directly affect solder joint strength and void rate.
Published: 2025-07-04Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.