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Here you can find knowledge about Reflow Soldering, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Introducing high-purity nitrogen into the reflow oven can significantly inhibit the oxidation reaction of solder joints, maintain a reducing atmosphere for the solder paste during the melting stage, and thereby reduce the void rate of solder joints for BGA and QFN devices. This effect is particularly prominent for the combination of PCBs with OSP surface finish and lead-free solder paste. Actual measurements from Jia Jinyuan reflow ovens show that the void area ratio decreased from 8.7% to 2.3%. The nitrogen flow rate should be stably controlled at 15–25 L/min, accompanied by verification of the furnace chamber sealing performance.
Published: 2023-01-08Nitrogen reflow in BGA/QFN precision soldering suppresses oxidation, improves wettability, and optimizes the flowability of molten metal, stably reducing the void rate from 18%~25% under air reflow to 4.2%~6.8%. The measured purity of the Jiajinyuan nitrogen generator reaches 99.999%, with a dew point ≤ -60℃. Combined with precise flow control (15~25L/min) and real-time monitoring of furnace oxygen concentration (≤100ppm), it can directly reuse existing reflow oven hardware to complete production line upgrades.
Published: 2022-09-19Due to the large heat capacity and high thermal conductivity of copper, thick copper board soldering suffers from delayed temperature rise and easily low peak temperature during reflow soldering. The soaking zone must be extended to 150–180 seconds to ensure sufficient melting and wetting of the solder paste; otherwise, defects such as cold solder joints, dry joints, and dull solder joints occur frequently. Actual measurements on Jia Jinyuan's production line show that when the soaking zone is less than 140 seconds, the void rate of BGA solder joints increases by 37%.
Published: 2022-07-20Unreasonable reflow soldering temperature curve settings will significantly aggravate typical defects such as voids and solder balls. Excessively fast preheating ramp-up causes the flux to boil violently and splatter, forming solder balls. Insufficient soaking or low peak temperature leads to poor solder wetting and hinders gas escape, inducing voids. Actual measurements on Jiajinyuan production lines show that when the ramp rate exceeds 3℃/s or the reflow time is less than 60 seconds, the BGA void rate generally rises above 15%.
Published: 2022-06-27If excessive flux remains after solder paste reflow soldering, especially between high-density PCBs or fine-pitch components, ionic contamination can easily form, leading to reduced insulation resistance, excessive leakage current, or even short-circuit failures. Although no-clean solder paste is nominally specified as not requiring cleaning, the active components of its flux residue, when coupled with moisture on the board surface, can still significantly degrade surface insulation performance.
Published: 2021-08-28When reflow soldering precision BGA/QFN devices, the heating rate directly affects solder joint void ratio, solder ball collapse consistency, and PCB warpage risk. In particular, a preheat ramp exceeding 3℃/s can easily cause ceramic substrate cracking, while insufficient flux residue control occurs when the soak stage duration below 150℃ is less than 90 seconds. Jia Jinyuan's measured data shows that the void ratio of QFN bottom solder joints increases by 27% as the heating slope rises by 1.2℃/s. The temperature difference across the entire board must be controlled within ±2.5℃ to ensure first-pass yield.
Published: 2021-03-25The solder paste optimization corresponding to the generation mechanism of tiny solder balls focuses on the dynamic coupling relationship among solder paste, solder ball solder paste, and solder paste reflow. By regulating the particle size distribution and sphericity of metal powder in the solder paste, the volatilization gradient of the flux, and the viscosity decay curve, the generation of 0.1～0.3mm tiny solder balls is significantly suppressed without sacrificing printing accuracy, and PPM-level defect reduction has been achieved in multiple automotive electronics production lines.
Published: 2021-02-27
The solder paste reflow profile must be dynamically adjusted according to the alloy composition, melting point range, and flux activity. For example, SAC305 requires a peak temperature of 235℃±5℃ and a time above liquidus of 60~90 seconds, while Sn63/Pb37 requires a peak temperature of 220℃±3℃ and a time above liquidus of 45~60 seconds. The metal powder particle size distribution and oxidation level of different solder pastes also significantly affect the ramp-up rate and soak zone settings.
Published: 2021-01-27First article inspection is the first gate for error prevention on the SMT production line. It is necessary to simultaneously verify the consistency between material models and the BOM, the thickness and offset of solder paste printing, the XYθ deviation of placement positions, and whether the temperature and time in each zone of the reflow profile meet the process window of JiajinYuan solder paste. Any inaccuracy in any link will cause irreversible defects such as cold solder joints, tombstoning, or cold soldering in mass production.
Published: 2020-07-12The reflow oven's temperature zone configuration must match the PCB thickness and component heat capacity. Thin boards require shortened preheating time to prevent warpage, while thick boards need extended soaking zones to ensure uniform heating of inner layers. Large heat capacity BGA or metal-cased components require stable peak temperature and sufficient reflow time. The Jiajinyuan reflow oven achieves precise adaptation through adjustable conveyor speed and independent temperature control for each zone.
Published: 2020-05-25Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.