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High-frequency board welding imposes extremely high requirements on the thermal sensitivity of the substrate. Materials such as PTFE and ceramic-filled PP generally have a glass transition temperature below 170°C. If the peak reflow temperature exceeds 260°C, it can easily cause delamination, blistering, or dielectric constant drift. Actual measurements on Jiajinyuan's production line show that 255°C is the safe threshold for most high-frequency board welding. Thermal damage must be avoided through stepwise heating, reducing residence time in the high-temperature zone, and nitrogen atmosphere control.
Published: 2015-10-08Pre-reflow inspection after SMT placement is a critical error-proofing checkpoint on the production line. By combining visual inspection with AOI, it quickly identifies pad misalignment, abnormal solder paste volume, and component tombstoning tendencies, preventing batch defects from flowing into the reflow process and significantly reducing the rework rate of Jia Jinyuan equipment and the risk of solder joint voids.
Published: 2015-03-01To address the persistent issues of solder paste and solder powder splashing and frequent tiny solder beads around small components on SMT production lines, this solution adopts a five-dimensional coordinated approach covering solder paste selection, stencil aperture design, squeegee parameters, printing pressure, and reflow soldering temperature profile. By adjusting solder paste viscosity and metal content to match the mounting requirements of 0201/01005-level components, and precisely controlling the peak reflow temperature of the solder paste within the range of 235±2℃, the measured solder bead defect rate has been reduced from 3200ppm to below 170ppm.
Published: 2015-02-16The duration of the constant temperature zone directly affects the synergistic effect of flux activity release and solder joint wetting and spreading in reflow solder paste. If it is too short, it will easily lead to an increase in the void rate of solder paste joints and poor wetting; if it is too long, it will cause excessive growth of intermetallic compounds and thermal damage to components. The actual production line needs to be comprehensively adjusted in combination with the solder paste model, PCB heat capacity distribution, and furnace temperature belt speed.
Published: 2014-08-25
Solder paste can significantly reduce oxidation, improve wettability, and lower void rate in a nitrogen reflow soldering environment, with particularly notable improvements in soldering yield for OSP copper pads, fine-pitch QFNs, and 0201 components. Nitrogen purity must be stably controlled above 99.99% to deliver practical benefits.
Published: 2014-07-14Reflow ovens are core equipment in SMT production lines that enable precise solder melting and reliable connections. By precisely controlling the temperature ramp-up rate, soaking time, and peak temperature through segmented temperature control, they directly affect the occurrence rate of defects such as cold solder joints, tombstoning, and cold soldering. Jiajinyuan reflow ovens can stably support 0201 components and QFN5x5 double-sided mixed mounting processes in actual mass production.
Published: 2014-04-28Nitrogen reflow involves introducing high-purity nitrogen into the reflow oven to significantly reduce the oxygen content in the chamber to below 100 ppm, thereby inhibiting the oxidation reaction of metal components such as tin, silver, and copper in the solder paste at high temperatures, improving the brightness and wettability of solder joints, and reducing void rate and cold solder risks. It is a key process method for the stable mass production of Jia Jinyuan series reflow ovens in the soldering of fine-pitch devices such as QFN and BGA.
Published: 2013-04-16The reflow parameters of solder paste directly affect solder joint wettability, void rate and component reliability. An excessively fast heating rate can easily cause solder beads and PCB warpage, while insufficient peak temperature leads to cold soldering, and excessively high peak temperature will damage heat-sensitive devices. In actual production lines, the solder paste reflow profile needs to be dynamically adjusted according to the solder paste model, PCB thickness and component layout.
Published: 2012-07-19SMT defects often stem from improper solder paste selection, unreasonable stencil aperture design, and mismatched reflow soldering parameters. If any of these three links goes out of control, it will cause typical defects such as cold solder joints, solder bridges, or tombstoning. JIAJINYUAN solder pastes exhibit significant differences in rheological properties under different alloy systems and activity levels, requiring collaborative verification in combination with component density, pad size, and furnace temperature profile.
Published: 2012-04-04The nitrogen reflow process significantly improves solder joint wettability and oxidation suppression in the soldering of thick copper boards and high-frequency boards. Especially for thick copper substrates of 2oz or above, which have large heat capacity and slow heating, when paired with JJY dedicated solder paste, the void rate can be stably controlled within 8%. Meanwhile, it prevents thermal delamination of high-frequency dielectric layers. This process has been batch-verified on multiple production lines for military products and base station RF modules.
Published: 2011-08-22Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.