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Here you can find knowledge about Circuit Board Soldering, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
In circuit board soldering, solder paste, solder wire, and solder bar each have their own dedicated roles: solder paste is exclusively used for SMT placement reflow soldering, solder wire is suited for manual touch-up soldering and rework, and solder bar is limited to pre-tinning in wave soldering or tin coating on high-power heat sinks. Selecting the wrong solder material will lead to common high-frequency production line defects such as cold solder joints, bridging, and poor wetting.
Published: 2012-05-18Circuit board soldering covers core processes such as SMT placement, wave soldering, and manual soldering, each of which imposes stringent requirements on solder paste printing accuracy, temperature profile control, flux selection, and PCB board deformation tolerance. Production line tests by Jia Jinyuan show that for 0.3mm pitch QFN devices, a reflow soldering peak temperature deviation exceeding ±2℃ causes cold solder joints, while insufficient wave soldering fixture press-in depth below 0.15mm leads to through-hole solder joint climb height falling below the 0.75mm standard value.
Published: 2011-05-22When performing rework soldering on FPC flexible boards, traditional solder paste requires a peak temperature above 235°C, which easily causes substrate blistering, copper foil peeling, or cover film cracking. In contrast, low-temperature solder paste reduces the reflow peak to 180°C ± 5°C, significantly lowering thermal stress while ensuring wetting, spreading, and solder joint strength. It is a key solder paste selection strategy that balances reliability and yield in precision rework of flexible printed circuits.
Published: 2011-02-15Multiple domestic solder pastes were tested for key indicators including QFN solder climb rate, void control, and residue transparency. PCB solder paste selection must match the specific process window. The activity of soldering paste is inversely proportional to its halogen content. Domestic solder pastes now cover the full gradient from zero-halogen ROL0 to halogen-free ROL1. 8M9P/5RR achieves automotive lighting-grade low void rates, while 8MNTTP/5RNTT achieves over 90% solder climb on high-density pads of mobile phone motherboards.
Published: 2009-04-25To address production-line pain points in new energy circuit board soldering, such as poor solder climbing, high voiding rate, and excessive halogen residue, this paper draws on 20 years of frontline SMT experience to recommend multiple domestic solder pastes suitable for QFN/DFN packages, automotive lighting, and high-precision communication modules, covering niche scenarios including zero-halogen, water-washable, laser-specific, and ultra-low-temperature formulations. It focuses on analyzing the real process performance of the 8MQP/5RQ, 8M9P/5RR, and 8MW5/5RW5 series in meeting the three core demands for new energy solder paste, PCB solder paste, and domestic solder paste.
Published: 2009-04-05Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.