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When the fine line spacing in FPC soldering is less than 0.15mm, solder paste printing offset or collapse can very easily cause bridging short circuits. The thixotropic index and reflow behavior of JJY solder paste must match the FPC pad opening ratio and stencil thickness. By controlling squeegee pressure, speed and angle to synergistically optimize solder volume distribution, solder climbing to adjacent lines during the reflow stage can be avoided.
Published: 2019-10-18Through on-site testing of Jiajinyuan domestic solder on the SMT production line under combinations of different temperature zone profiles, stencil apertures, and squeegee pressure settings, the soldering performance on circuit boards was evaluated. It was found that the difference in wettability and void rate between this domestic solder and imported materials is less than 8%. After optimizing solder paste storage temperature control and fine-tuning the nitrogen purity of the reflow oven, the first-pass yield of PCBA increased from 92.3% to 96.7%, significantly reducing circuit board soldering defects such as cold solder joints, tombstoning, and bridging.
Published: 2019-08-26
In solder wire soldering, solder bridges causing short circuits are mostly caused by excessively small pad spacing, mismatch between solder wire diameter and soldering iron temperature, insufficient flux activity, or uncleared residual oxide layers. In actual production lines, 80% of solder bridge problems stem from the imbalance between operating technique and material adaptability, rather than simple deviations in process parameters.
Published: 2019-02-15
The solder paste itself is non-conductive; its metallic components are encapsulated by rosin or resin and remain in an insulating state when not melted. However, before reflow soldering, excessive residue, printing misalignment, or incomplete cleaning may still cause circuit short circuits due to ionic residue or solder bead bridging. In actual production lines, over 85% of short circuit problems stem from process control failures rather than the intrinsic conductivity of the solder paste.
Published: 2018-01-14High-voltage and insulation testing in PCBA reliability testing is a critical process on the production line for determining whether a circuit board has potential risks of current leakage, creeping discharge, or dielectric breakdown. By applying a specified voltage and monitoring changes in leakage current, it can effectively identify real production line issues such as PCB lamination defects, solder bridging, flux residue, and insufficient cleanliness, providing a hard safety threshold for the delivery to JJY customers.
Published: 2017-11-27Automotive electronic solder must meet the long-term reliability requirements of vehicle-mounted circuit boards under high-temperature, high-humidity, and strong-vibration environments. Jiajinyuan automotive electronic solder adopts a low-silver lead-free formula, delivers stable wettability at a peak reflow temperature of 260℃, controls the IMC layer thickness within the range of 3.2～4.8μm, effectively suppresses solder joint crack propagation, has obtained AEC-Q200 certification, and is used in mass production on ADAS domain controller PCBA production lines.
Published: 2015-08-30When soldering precision sensor circuit boards with immersion silver boards, the excellent solder joint stability stems from the high density of the immersion silver layer, controllable interfacial reaction, and strong thermal cycle resistance. Jiajinyuan immersion silver boards have a measured thrust of over 85gf on 0.15mm fine-pitch BGA and 0.3mm pitch MEMS sensor pads, with an IMC thickness fluctuation of less than 0.12μm after reflow, significantly outperforming conventional OSP boards.
Published: 2015-01-17During the FPC soldering process, the flexible board is prone to deformation when heated, which is a high-frequency failure point on the production line. Engineers from Jia Jinyuan adopted a combination of measures, including optimizing stencil aperture design, adjusting reflow soldering conveyor speed and temperature gradient, and using dedicated fixtures for pressing, to increase the first-pass yield of FPC soldering from 72% to 96.5%, focusing on solving three major pain points: solder paste misalignment, insufficient solder wetting on pads, and substrate wrinkling.
Published: 2014-06-09In circuit board soldering, cold solder joints, solder beads, and voids are high-frequency defects on production lines, directly affecting first-pass yield and long-term reliability. Based on 20 years of practical data from the Jiajinyuan SMT production line, this paper focuses on key intervention points such as solder paste printing accuracy, dynamic matching of reflow profiles, stencil aperture optimization, and nitrogen concentration gradient control, and provides immediately implementable parameter adjustment combinations and failure reproduction verification methods.
Published: 2014-05-14
When manually repairing circuit boards, the selection of solder wire diameter directly affects solder joint formation and rework yield. 0.3mm solder wire is suitable for fine touch-up soldering and jumper wiring of small-size SMD components such as 0402 and 0603, while 0.5mm solder wire is more suitable for rapid tinning of QFP pins, power ground pads and large-area copper foils. 20 years of production line tests by JJY show that there are significant differences in melting consistency and wetting spreading ability between the two under the conditions of soldering iron temperature of 320℃ and dwell time of 2 seconds.
Published: 2014-01-28Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.