Case analysis: on the assembly line, lead-free Solder Paste is being wasted badly every day. The solder is exposed to high temperatures for too long, causing the Flux to volatilize, and the soldering effect during the load/unload period is poor. Sometimes lead-free solder paste opened in the morning is still being used in the afternoon, and flux even has to be added. In such cases, the quality of the boards after reflow is seriously affected. How can this be solved? Below, the Solder Paste Manufacturer explains:

1. SMT mechanical printing

1. If this is an isolated case, I do not recommend extravagant waste. It is better to use solder paste at regular intervals and in fixed quantities, calling it up every two hours. Done this way, printing goes more smoothly and the quality of the scraped paste is naturally better, and the boards after reflow are relatively better. One point: whenever there is a long idle period in the afternoon, it is best to put the solder paste back into the bottle to prevent the flux from oxidizing.

2. Multiple SMT production lines share one bottle of Lead-free solder paste, opening a new bottle only after the previous one is finished. In this way, exposure to air is reduced and there is no need to allocate a separate bottle to each line, so less is left unused and wasted. If solder paste is exposed to high temperatures for a long time, it is effectively scrapped.

Second, hand printing

With manual printing, the waste can be even greater. It is recommended to use one bottle of solder paste at a time, which speeds up consumption and reduces the time lead-free solder paste is exposed to high temperatures, opening a new bottle only after the current one is used up. At the same time, with manual operation, operators should first strengthen their technique so as to reduce waste. To recap the case: a production line wastes a great deal of lead-free solder paste daily. The solder is exposed to high temperatures for too long, the flux evaporates, and the effect during the furnace load/unload period is poor. Sometimes lead-free solder paste opened in the morning is still used in the afternoon, which seriously affects the quality of the boards after reflow. How can this be solved?

1. SMT mechanical printing

1. If this is an isolated case, I do not recommend extravagant waste. It is better to use solder paste at regular intervals and in fixed quantities, calling it up every two hours. Done this way, printing goes more smoothly and the quality of the scraped paste is naturally better, and the boards after reflow are relatively better. One point: whenever there is a long idle period in the afternoon, it is best to put the solder paste back into the bottle to prevent the flux from oxidizing.

2. Multiple SMT production lines share one bottle of lead-free solder paste, opening a new bottle only after the previous one is finished. In this way, exposure to air is reduced and there is no need to allocate a separate bottle to each line, so less is left unused and wasted. If solder paste is exposed to high temperatures for a long time, it is effectively scrapped.

Second, hand printing

With manual printing, the waste can be even greater. It is recommended to use one bottle of solder paste at a time, which accelerates consumption and reduces the time lead-free solder paste is exposed to high temperatures, opening a new bottle only after the current one is used up. At the same time, with manual operation, operators should first strengthen their technique so as to reduce waste.