SMT Solder Paste Manufacturers.
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Here you can find knowledge about SMT Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
SMT solder paste must be stored refrigerated to inhibit oxidation of the metal powder and chemical reactions of the flux, preventing increased viscosity, aggravated slump, and reduced printing accuracy. The warm-up procedure must strictly follow the process of 4 hours of standing at room temperature followed by 2 hours of stirring, to avoid splashing and cold solder joints caused by condensation water contamination. This is a critical step that production line engineers must not skip before starting work each day.
Published: 2015-06-05Pre-reflow inspection after SMT placement is a critical error-proofing checkpoint on the production line. By combining visual inspection with AOI, it quickly identifies pad misalignment, abnormal solder paste volume, and component tombstoning tendencies, preventing batch defects from flowing into the reflow process and significantly reducing the rework rate of Jia Jinyuan equipment and the risk of solder joint voids.
Published: 2015-03-01OSP board soldering is a critical process in SMT production lines that is highly prone to cold solder joints, poor wetting, and pad oxidation failures. It is necessary to optimize stencil aperture design, solder paste selection, reflow profile, and first-article verification process in response to the thermal sensitivity, thin-layer characteristics, and weak adhesion to the copper substrate of the OSP anti-oxidation protective film. Otherwise, even if the placement accuracy meets the standards, batch issues such as dull solder joints, insufficient solder climb height, or abnormal ICT test impedance will occur after reflow.
Published: 2014-11-10SMT defects are a high-frequency source of failures on production lines. Typical issues such as solder balls, voids, tombstoning, and bridging are directly related to printing accuracy, reflow profile, and component coplanarity. Jia Jinyuan production line data shows that 83% of SMT defects stem from solder paste volume deviation exceeding ±15% or improper matching between stencil apertures and PADs.
Published: 2014-09-14During the FPC soldering process, the flexible board is prone to deformation when heated, which is a high-frequency failure point on the production line. Engineers from Jia Jinyuan adopted a combination of measures, including optimizing stencil aperture design, adjusting reflow soldering conveyor speed and temperature gradient, and using dedicated fixtures for pressing, to increase the first-pass yield of FPC soldering from 72% to 96.5%, focusing on solving three major pain points: solder paste misalignment, insufficient solder wetting on pads, and substrate wrinkling.
Published: 2014-06-09Reflow ovens are core equipment in SMT production lines that enable precise solder melting and reliable connections. By precisely controlling the temperature ramp-up rate, soaking time, and peak temperature through segmented temperature control, they directly affect the occurrence rate of defects such as cold solder joints, tombstoning, and cold soldering. Jiajinyuan reflow ovens can stably support 0201 components and QFN5x5 double-sided mixed mounting processes in actual mass production.
Published: 2014-04-28The thickness and aperture design of SMT stencils are core variables determining the forming quality of solder paste printing. For 0402 and 0201 components, the solder paste volume deviation between 0.12mm and 0.15mm stencils can reach 28%. When the aperture aspect ratio is less than 1.5, the edge collapse rate increases by 3 times. Measured data from Jia Jinyuan's production line shows that, under the same pad conditions, trapezoidal apertures improve the solder paste release rate by 12% compared to rectangular apertures.
Published: 2014-02-02Pin dip soldering uniformly covers the surface of component pins with a layer of tin-lead or lead-free solder, significantly improving pin solderability and wetting ability, and resolving cold solder joints and missed solder joints caused by plating oxidation and storage aging. It provides a stable and reliable soldering foundation for SMT placement, and is a key pre-treatment process for Jia Jinyuan's production line to handle high-density PCBs and fine-pitch QFP packages.
Published: 2013-10-14The tombstoning phenomenon in SMT defects is mostly caused by uneven heating at both ends of chip components, commonly seen in resistors and capacitors in 0402 and 0603 packages. When the solder paste at one end melts and wets first while the other end remains solid, the imbalance of surface tension pulls the component vertically upward. Statistics from JJY's production line show that this defect accounts for 37% of post-placement rework volume, with root causes concentrated in deviations in stencil aperture design, abnormal temperature zone distribution in reflow ovens, and asymmetric PCB layout.
Published: 2013-08-26To meet the actual production line requirements for solder materials used in industrial control motherboards, this summary focuses on the compatibility issues of solder paste in SMT printing, reflow soldering and wave soldering processes, and elaborates on the synergistic performance of Jiajinyuan solder paste and matching solder bars in high-reliability soldering, covering key process parameters such as viscosity adaptation, metal content control, and residue corrosion inhibition.
Published: 2013-06-25Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.