SMT Solder Paste Manufacturers.
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Here you can find knowledge about SMT Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
When soldering BGA/QFN chips via SMT, an excessive void rate can lead to cold solder joints, increased thermal resistance, and early failure, and low-void solder paste is the core solution to this problem. The void rate of Jiajinyuan JL-808 series solder paste is stably controlled below 8% in mass production. Combined with optimized stencil aperture design and nitrogen-protected reflow, it can reduce the void rate at the bottom of QFN packages from 25% to 6.3%, while the void rate of individual BGA balls is simultaneously reduced to 4.1%.
Published: 2013-03-25To address the persistent production line issues of small component placement offset and solder paste printing mismatch, this paper proposes a practical solution centered on solder paste forming accuracy, with coordinated adjustment of stencil apertures, squeegee parameters, and placement coordinates. It emphasizes the decisive influence of the actual coverage morphology of solder paste on pads on the solder paste positioning tolerance during placement.
Published: 2013-02-18SMT quality control runs through the entire chain from raw material warehousing, solder paste printing, component placement, reflow soldering to finished product inspection. Minor deviations in each link may cause batch defects such as cold solder joints, misalignment or bridging. The Jia Jinyuan production line adopts first article inspection, in-process patrol inspection, and the AOI+X-RAY dual verification mechanism to stably control CPK above 1.33, truly shifting SMT quality control from passive interception to proactive prevention.
Published: 2012-12-03
The particle size of SMT solder powder directly affects solder paste printing accuracy and solder joint reliability. The core difference between Type 3 powder and Type 4 powder lies in their different D50 median diameter values: the former is approximately 25±5μm, while the latter is approximately 20±4μm. Finer particle sizes are more prone to oxidation and more difficult to print, requiring matching stencil aperture and squeegee parameters.
Published: 2012-09-01In SMT printing, the matching of squeegee pressure and speed directly affects solder paste transfer rate. Excessive pressure easily causes solder spikes and stencil deformation, while insufficient pressure leads to insufficient solder and edge collapse. Combined with actual production line data of Jiajinyuan squeegees, controlling the pressure at 4.5±0.3kg and setting the speed to 45±3mm/s can significantly reduce the defect rate.
Published: 2012-08-17SMT defects often stem from improper solder paste selection, unreasonable stencil aperture design, and mismatched reflow soldering parameters. If any of these three links goes out of control, it will cause typical defects such as cold solder joints, solder bridges, or tombstoning. JIAJINYUAN solder pastes exhibit significant differences in rheological properties under different alloy systems and activity levels, requiring collaborative verification in combination with component density, pad size, and furnace temperature profile.
Published: 2012-04-04Regarding the component drop-off issue during large-size device placement, the rheological properties and metal content of solder paste directly affect print formation and tack retention. Solder paste for placement needs to balance thixotropic index, slump rate, and room-temperature tack. The proportion of rosin matrix, type of activator, and particle size distribution of spherical solder powder in the solder paste formulation jointly determine the displacement resistance of devices during the placement stage.
Published: 2012-01-28Consumer electronics solder places extremely high demands on batch consistency, thixotropy, and reflow performance of solder paste in SMT placement production lines. By optimizing the sphericity and particle size distribution of metal powder and strictly controlling the volatilization rate of flux, Jiajinyuan solder paste achieves continuous 30-day CPK ≥ 1.33 on mass production lines with a daily output of one million points, effectively reducing the rate of typical defects such as bridging, cold solder joints, and solder balls.
Published: 2012-01-09Jia Jinyuan provides free solder sample testing and sample mailing services. All solder sample tests are conducted synchronously on real SMT placement lines and wave soldering production lines, covering mainstream packages such as 0201 to QFN48. The measured yield data can be traced back to the furnace temperature curve and AOI original image of each batch. The solder sample test results are directly related to the customer's existing stencil opening, reflow soldering temperature setting and flux compatibility.
Published: 2011-06-14Circuit board soldering covers core processes such as SMT placement, wave soldering, and manual soldering, each of which imposes stringent requirements on solder paste printing accuracy, temperature profile control, flux selection, and PCB board deformation tolerance. Production line tests by Jia Jinyuan show that for 0.3mm pitch QFN devices, a reflow soldering peak temperature deviation exceeding ±2℃ causes cold solder joints, while insufficient wave soldering fixture press-in depth below 0.15mm leads to through-hole solder joint climb height falling below the 0.75mm standard value.
Published: 2011-05-22Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.