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Here you can find knowledge about Printing Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Solder sample testing should focus on four practical dimensions: printing accuracy, wetting and spreading capability, void rate control, and solder ball formation tendency. Through methods such as stencil aperture matching verification, post-reflow solder joint morphology observation, X-ray void area statistics, and solder ball counting under a microscope, the adaptation boundaries of Jia Jinyuan solder under different PCB pad designs and process windows can be quickly identified.
Published: 2025-05-15Tombstoning is one of the most common defects in SMT solder paste printing. When the stencil thickness does not match the pad design, the solder paste is easily pulled up during the demolding stage, forming pointed residues. If the printing speed is too fast at this time, the shear stress superimposed on the demolding tension will significantly aggravate the degree of tombstoning, leading to subsequent placement offset, reflow bridging, and even cold solder joints.
Published: 2024-09-02SMT printing is a key process in which SMT stencils evenly transfer solder paste to PCB pads, directly affecting placement accuracy and reflow soldering yield. In actual production lines, solder paste viscosity, stencil aperture size, squeegee pressure, and printing speed must be coordinated and matched; any slight deviation will cause typical defects such as insufficient solder, solder bridging, or misalignment.
Published: 2024-07-28
Solder paste printing forming spikes is a high-frequency fault on SMT production lines. The root causes are concentrated in three aspects: mismatch of solder paste rheological properties, unreasonable stencil aperture design, and unbalanced coordination between squeegee parameters and printing speed. The solution requires simultaneous adjustment of solder paste viscosity grade, optimization of squeegee pressure and angle combination, and calibration of stencil support tension and PCB positioning accuracy.
Published: 2023-03-12
Jiajinyuan has launched a high-stability no-clean solder paste, specifically designed for 01005 micro components. By optimizing the alloy powder particle size distribution (T4/T5), rosin-based flux system, and rheological property control, it significantly improves printing anti-slump performance while maintaining halogen-free and lead-free high-temperature characteristics, meeting the high solder climbing rate requirements for QFN/DFN.
Published: 2022-12-14Tombstoning causes spike-like protrusions at the edges of solder paste deposits. During placement, component pins are easily pushed off position or pressed into the stacked solder paste area. During reflow, the fluidity of molten solder paste increases, sharply raising the risk of bridging. The Jiajinyuan G-8800 series solder paste is most prone to exposing this defect under conditions of a 35μm stencil and a 45° squeegee angle.
Published: 2022-08-06In fine-pitch pin printing, the pinhead phenomenon directly affects solder paste transfer rate and subsequent placement accuracy. It is necessary to synchronously monitor the length, morphology and repeatability of pinheads during first article inspection, in-process patrol inspection and stencil cleaning. Production line data from JJY shows that for 0.4mm pitch QFN devices, a pinhead exceeding 0.15mm will trigger the risk of solder bridging.
Published: 2020-07-24First article inspection is the first gate for error prevention on the SMT production line. It is necessary to simultaneously verify the consistency between material models and the BOM, the thickness and offset of solder paste printing, the XYθ deviation of placement positions, and whether the temperature and time in each zone of the reflow profile meet the process window of JiajinYuan solder paste. Any inaccuracy in any link will cause irreversible defects such as cold solder joints, tombstoning, or cold soldering in mass production.
Published: 2020-07-12Standardized operations for solder paste replenishment and stirring in high-speed SMT printing production lines directly determine printing yield and equipment utilization. Based on the actual adaptability of Jiajinyuan solder paste at squeegee speeds above 300mm/s, this article details key control points such as replenishment frequency, temperature control window, and manual/automatic stirring parameter settings. All operations have been verified through 72 consecutive hours of production line testing.
Published: 2020-04-09Syringe dispensing solder paste and stencil printing solder paste are often used interchangeably in actual production lines, but differences in their rheological properties can easily cause issues such as needle clogging, stringing, and printing misalignment. Based on JJY's 20 years of on-site SMT experience, this paper focuses on the interchangeability boundaries between dispensing solder paste and printing solder paste, key points for thixotropic index matching, and a coordinated improvement plan for needle clogging based on the three core elements of temperature control, pressure, and cleaning.
Published: 2020-03-22Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.