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Here you can find knowledge about Printing Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The size, shape, and wall roughness of SMT stencil apertures directly affect the paste filling, release, and pad coverage during solder paste printing. Improper design can lead to typical defects such as solder bridging, insufficient solder, and misalignment. Based on real production line failure cases, this paper reveals five high-frequency misconceptions, including improper aperture ratio, excessive inverse trapezoid, and unprocessed edge burrs, along with their root-cause solutions.
Published: 2026-08-27
Solder paste slump after printing directly affects component placement accuracy and reflow soldering quality. The main causes include low solder paste viscosity, improper stencil aperture design, excessive squeegee pressure, and uncontrolled ambient temperature and humidity. Typical manifestations include blurred edges, bridging, or height drop exceeding 15% within 30 seconds after printing. Systematic troubleshooting should be conducted in combination with practical parameters such as viscosity of 750–950 Pa·s, squeegee angle of 55°–62°, and release speed of 25–40 mm/s.
Published: 2026-08-27There are significant differences in solder paste printing adaptability, which are closely related to machine parameters, operating specifications and solder paste characteristics. Reasonably adjusting equipment parameters and optimizing the process flow can significantly improve the printing effect.
Published: 2026-08-24Solder paste clogging the stencil is a common problem in SMT production, affecting soldering quality and efficiency. Focusing on the phenomenon of solder paste clogging the stencil, this article analyzes the causes and provides practical solutions and preventive measures to help engineers optimize the process flow in daily work.
Published: 2026-08-24Solder paste printing offset is a common problem in SMT production, which directly affects soldering quality and product reliability. Analyzing the core causes of solder paste printing offset helps quickly identify problems and optimize the process flow.
Published: 2026-08-24No abnormalities were found in the stencil aperture, yet solder paste printing still exhibits insufficient solder deposition. The core issue may lie in the solder paste itself or the operating process. This article analyzes common causes and provides practical recommendations to help resolve the challenge of insufficient solder deposition during solder paste printing.
Published: 2026-08-24
Optimizing the solder paste printing process is a key step in improving the efficiency of SMT production lines, and the collaborative optimization of printing parameters and stencil design enhances soldering yield.
Published: 2026-08-24In the solder paste printing process, excessively long residence time of solder paste can cause various problems, such as reduced tackiness, slump, and poor soldering. Timely control of solder paste usage time is key to ensuring product quality.
Published: 2026-08-24What are the causes and solutions for the appearance of solder beads during solder paste printing? D
Published: 2026-05-12Tombstoning is a common defect in the SMT printing process. Replacing the solder paste with better adaptability and synchronously adjusting the squeegee pressure, speed, and release parameters can significantly reduce the incidence of tombstoning. Jiajinyuan JY-808 series solder paste exhibits superior shear-thinning properties and release consistency in 0.3mm fine-pitch printing.
Published: 2025-12-20Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.