SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about High Anti-Oxidation Solder Bar, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The solder for energy storage modules maintains solder joint integrity under 125°C high-temperature cycling and 20G vibration stress. The Jiajinyuan JN-808 series solder improves grain boundary strength through microalloying design, and with an optimized reflow profile, the IMC layer thickness is stably controlled within the range of 3.2–4.5 μm. Measured shear force attenuation after 5000 thermal cycles is less than 8%, effectively solving the cold solder joint and cracking problems caused by thermal expansion and contraction and mechanical vibration during long-term operation of energy storage systems.
Published: 2023-04-20
Jiajinyuan has launched a high-stability no-clean solder paste, specifically designed for 01005 micro components. By optimizing the alloy powder particle size distribution (T4/T5), rosin-based flux system, and rheological property control, it significantly improves printing anti-slump performance while maintaining halogen-free and lead-free high-temperature characteristics, meeting the high solder climbing rate requirements for QFN/DFN.
Published: 2022-12-14For soldering gold-plated boards, it is necessary to balance the thickness of the pad gold layer with the activity matching of the flux to avoid black pad, cold solder joints, and excessive IMC growth. Jia Jinyuan's gold-plated board soldering solution has achieved a soldering defect rate below 0.3% in aerospace modules and medical equipment, with the key lying in the collaborative implementation of solder paste selection, reflow profile gradient control, and an oxygen content ≤100ppm under a nitrogen atmosphere.
Published: 2022-11-25To address the issues of large fluctuations in solder paste deposition volume and frequent cold solder joints and solder bridges during high-density PCB solder paste printing, this paper proposes a solder paste volume control method based on measured production line data, with stencil aperture optimization, dynamic calibration of squeegee pressure, and temperature control of solder paste viscosity as its core components. It focuses on solving the challenge of solder paste deposition consistency for 0.4mm pitch QFN and 0201 components, significantly reducing the proportion of abnormal batches where the SPI first-pass yield is below 92%.
Published: 2022-08-17Due to the large heat capacity and high thermal conductivity of copper, thick copper board soldering suffers from delayed temperature rise and easily low peak temperature during reflow soldering. The soaking zone must be extended to 150–180 seconds to ensure sufficient melting and wetting of the solder paste; otherwise, defects such as cold solder joints, dry joints, and dull solder joints occur frequently. Actual measurements on Jia Jinyuan's production line show that when the soaking zone is less than 140 seconds, the void rate of BGA solder joints increases by 37%.
Published: 2022-07-20Leveraging its solder ODM R&D capabilities, Jia Jinyuan has developed a customized solder system featuring a low void rate (≤3%), a reflow peak temperature ≤220°C, and an extended oxidation resistance lifespan of over 72 hours, addressing pain points such as excessive void rate in BGA packaging, low-temperature soldering requirements for temperature-sensitive devices, and printing defects caused by solder paste oxidation on production lines. This system has been batch-validated on the production lines of multiple automotive electronics and medical equipment customers.
Published: 2022-03-17When SMT mounting 01005 and BGA precision components, extremely high placement accuracy is required. It is necessary to simultaneously control the nozzle vacuum stability, visual system calibration error, PCB thermal deformation, and solder paste collapse state. Any slight deviation will cause batch defects such as tombstoning, cold solder joints, and solder bridges. Actual measurements on the Jiajinyuan production line show that a placement offset exceeding 25 μm for 01005 devices leads to a 37% increase in open circuit rate after reflow. Poor coplanarity of BGA solder balls is directly related to placement pressure fluctuations exceeding 0.3 N.
Published: 2022-01-28
For BGA high-density packaging scenarios, Jiajinyuan's halogen-free, low-void solder paste 8M9P/5RR series has completed production line verification at leading packaging and testing customers. The measured void rate is stably controlled within 3%. After reflow soldering, the solder joints exhibit uniform wetting and a dense, continuous IMC layer, raising the first-pass yield of BGA devices from 92.7%
Published: 2021-07-14When manually soldering and repairing old PCBs, oxidized solder pads cause poor tinning and frequent cold solder joints. High-activity solder wire significantly improves the first-pass soldering success rate through stronger oxide film penetration and lower wetting temperature, and is especially suitable for manual soldering rework scenarios of communication boards and industrial control motherboards in service for over 8 years.
Published: 2021-06-22Welding thick copper boards directly determines the high-current carrying capacity and long-term operational stability of solder joints in new energy power boards. By optimizing the synergy among pad design, solder paste selection, and reflow profile, JJY ensures that solder joints on 2mm thick copper layers maintain a temperature rise within 35°C under a continuous current of 150A, avoiding common production line failures such as cold solder joints, excessive void rates, and thermal stress cracking.
Published: 2021-04-21Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.