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Here you can find knowledge about High Anti-Oxidation Solder Bar, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
When soldering 5G devices on high-frequency PCBs, solder faces the practical issue of increased void rate that exacerbates signal attenuation. By optimizing metal content, rheological properties, and flux volatilization pathways, low-void solder paste has been verified on actual production lines of the Jiajinyuan JH-5G series, stably controlling the void rate of BGA solder joints within 8%, significantly improving the impedance continuity and return loss performance of RF modules in the millimeter-wave frequency band.
Published: 2021-01-19When soldering BGA devices on thick copper boards, due to the large heat capacity and slow heating rate, the flux in the solder paste does not volatilize sufficiently and gas escape is hindered, making it extremely easy to form void defects inside solder joints. It is necessary to select a special solder paste with low residue, high activity, and a wide reflow window; otherwise, the void rate generally exceeds 25%, far exceeding the requirement of ≤15% for IPC-A-610 Class G.
Published: 2020-12-08The solder for industrial control motherboards must maintain zero solder joint cracking under wide temperature range, high vibration and long-cycle operating conditions. Jiayuan's high-reliability halogen-free formula, by optimizing the SnAgCu alloy ratio and active flux system, keeps the IMC layer thickness stably at 3.2±0.4μm after 500 cycles of thermal shock from -40℃ to 85℃, completely avoids electromigration failure caused by halogen corrosion, and significantly improves the service life of industrial control motherboard solder in harsh scenarios such as rail transit and power monitoring.
Published: 2020-07-01Standardized operations for solder paste replenishment and stirring in high-speed SMT printing production lines directly determine printing yield and equipment utilization. Based on the actual adaptability of Jiajinyuan solder paste at squeegee speeds above 300mm/s, this article details key control points such as replenishment frequency, temperature control window, and manual/automatic stirring parameter settings. All operations have been verified through 72 consecutive hours of production line testing.
Published: 2020-04-09
Jiajinyuan 5RLJ laser solder paste is optimized specifically for laser heating soldering scenarios. It adopts a synergistic design of rosin-based systems with multiple specifications of high-temperature alloy powders including 0307/105/305 and 00507BN, delivering stable performance with bright solder joints and no solder ball spattering within the 240–260℃ soldering window. Halogen
Published: 2020-02-19
Excessive volatilization of solder paste during high-temperature soldering can lead to typical defects such as solder balls, cold solder joints, and bridging. This is especially likely to induce splattering and poor wetting in a nitrogen atmosphere or during reflow soldering with a high heating rate, directly affecting the SMT first-pass yield and long-term reliability.
Published: 2019-09-23
Abnormal solder paste viscosity directly leads to high-frequency production line defects such as printing defects, component placement misalignment, and reflow voids. Excessively high solder paste viscosity easily causes printing skipping and stencil clogging, while excessively low viscosity leads to slump, bridging, and solder balls. During actual debugging, dynamic adjustments must be made in combination with ambient temperature and humidity, squeegee parameters, and batch differences of solder paste.
Published: 2019-04-28Bridging is the core defect causing a sharp drop in yield for fine-pitch chips (such as 0.4mm pitch QFN and 0.3mm pitch BGA) in high-speed SMT production lines. Its causes are concentrated in the combined effect of solder paste printing offset, mismatch in stencil aperture design, and fluctuations in placement accuracy. Actual measurements on Jia Jinyuan production lines show that bridging accounts for 68% of total solder joint defects, far exceeding cold solder joints and tombstoning.
Published: 2019-03-29Due to the large heat capacity and slow heating rate of thick copper plate welding, wave soldering is prone to missing solder. Selecting high-wettability solder bars can significantly improve the spreading ability of molten solder on thick copper substrates. Combined with the collaborative optimization of process parameters such as increasing the preheating temperature to 130℃～140℃ and reducing the chain speed to 1.0m/min～1.2m/min, it effectively solves problems such as insufficient solder joints, bridging defects, and cold solder on the back of the PCB.
Published: 2018-08-29Solder for 5G equipment must maintain zero solder joint cracking under complex operating conditions such as high-frequency vibration, wide temperature cycling, and high humidity and salt spray. Jiajinyuan's halogen-free high-reliability solder, through optimizing the SnAgCu main alloy ratio and the compounding of nano-scale active flux, achieves a solder joint shear force attenuation of <8% after 500 cycles of thermal shock from -40°C to +125°C, with a halogen content of <900ppm, fully meeting the long-term reliability requirements for 5G equipment solder in high-density interconnect scenarios such as 5G base station RF modules and millimeter-wave antenna arrays.
Published: 2018-04-27Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.