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Here you can find knowledge about Cold Solder Prevention, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Cold solder joint is one of the most frequent soldering defects on SMT production lines. Its cause is often misjudged as insufficient solder paste activity, but in fact, it mostly stems from the deterioration of pad solderability combined with mismatched flux activity. By specifically improving the wetting ability of the pad surface, selecting JJY JY-602 medium-high activity no-clean flux, and strictly controlling the OSP film thickness and nitrogen purity, the cold solder joint rate can be reduced from 3.2‰ to below 0.4‰ without changing the reflow profile.
Published: 2010-04-22Cold soldering is one of the most hidden and stubborn soldering defects in SMT production lines. It is often induced by a combination of non-compliant reflow temperature profiles and excessive PCB heat capacity, resulting in insufficient melting of solder paste, poor wetting of solder joints, and insufficient thrust. In Jiajinyuan cold soldering cases, 83% stem from a reflow zone peak temperature below 217℃ and a heating ramp rate lower than 1.5℃/s.
Published: 2010-02-04Cold solder joint is a fatal defect common to wave soldering and SMT reflow soldering, with causes spanning multiple stages such as solder paste printing misalignment, oven temperature profile mismatch, PCB pad oxidation, insufficient flux activity, and conveyor speed fluctuations. Jia Jinyuan production line data shows that over 65% of soldering defects caused by cold solder joints stem from insufficient preheating and deteriorated interfacial wetting when nitrogen purity is below 99.99%.
Published: 2009-11-12Cold soldering problems often stem from the fact that the actual peak temperature of the reflow oven fails to reach the solder paste activity window. Production line verification by Jiajinyuan shows that conducting oven temperature tests at least once a week can stably control the cold soldering defect rate within 300ppm. The fluctuation range of each temperature zone is measured using a KIC temperature profiler to ensure sufficient solder paste melting and that the thickness of the intermetallic compound (IMC) layer meets the standard.
Published: 2009-06-07To address the frequent occurrence of cold solder joint defects on SMT production lines, this domestic solder paste, through optimized alloy powder ratio and flux activity design, achieves nearly 100% solder wetting rate on QFN/DFN devices while significantly reducing void rate. Its multiple product lines, including halogen-free, zero-halogen, water-washable and laser-compatible variants, cover different process requirements, making it a cost-effective anti-cold-solder-joint solder paste solution to replace imported SMT solder pastes.
Published: 2009-04-19Insufficient solder paste volume on low-solder pads is the main cause of high-frequency cold soldering defects in SMT production lines, directly resulting in poor solder joint wetting, increased void rate, and failed thrust tests. When Jiajinyuan solder paste is printed through a 0.12mm thick stencil, if the squeegee pressure is below 4.5kg and the speed exceeds 40mm/s, discontinuous solder volume is extremely likely to form on the edges of 0.3mm pitch QFN pads, requiring simultaneous adjustment of the release speed and PCB support flatness.
Published: 2009-03-03Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.